參數(shù)資料
型號: AD9231BCPZRL7-80
廠商: Analog Devices Inc
文件頁數(shù): 29/36頁
文件大?。?/td> 0K
描述: IC ADC 12BIT 80MSPS 64LFCSP
標準包裝: 750
位數(shù): 12
采樣率(每秒): 80M
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 2
功率耗散(最大): 166.5mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 64-LFCSP-VQ(9x9)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 4 個單端,單極;2 個差分,單極
AD9231
Rev. A | Page 35 of 36
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
09
17
07
-C
6.35
6.20 SQ
6.05
0.25 MIN
TOP VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
EXPOSED PAD
(BOTTOM VIEW)
SEATING
PLANE
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 59. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad (CP-64-4)
Dimensions shown in millimeters
ORDERING GUIDE
Notes
Temperature Range
Package Description
Package Option
AD9231BCPZ-80
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZRL7-80
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZ-65
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZRL7-65
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZ-40
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZRL7-40
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZ-20
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231BCPZRL7-20
40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-4
AD9231-80EBZ
Evaluation Board
AD9231-65EBZ
Evaluation Board
AD9231-40EBZ
Evaluation Board
AD9231-20EBZ
Evaluation Board
1 Z = RoHS Compliant Part.
2 The exposed paddle (Pin 0) is the only GND connection on the chip and must be connected to the PCB AGND.
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