參數(shù)資料
型號: AD9238BCP-65EBZ
廠商: Analog Devices Inc
文件頁數(shù): 39/48頁
文件大?。?/td> 0K
描述: BOARD EVAL WITH AD9238BCP-65
設(shè)計(jì)資源: AD9238 Eval Brd Gerber File
標(biāo)準(zhǔn)包裝: 1
ADC 的數(shù)量: 2
位數(shù): 12
采樣率(每秒): 65M
數(shù)據(jù)接口: 并聯(lián)
輸入范圍: 2 Vpp
在以下條件下的電源(標(biāo)準(zhǔn)): 640mW @ 65MSPS
工作溫度: -40°C ~ 85°C
已用 IC / 零件: AD9238-65
已供物品:
相關(guān)產(chǎn)品: AD9238BCPZ-20-ND - IC ADC 12BIT DUAL 20MSPS 64LFCSP
AD9238BCPZ-40-ND - IC ADC 12BIT DUAL 40MSPS 64LFCSP
AD9238BCPZ-65-ND - IC ADC 12BIT DUAL 65MSPS 64LFCSP
AD9238BSTZRL-40-ND - IC ADC 12BIT DUAL 40MSPS 64LQFP
AD9238BCPZRL-65-ND - IC ADC 12BIT DUAL 65MSPS 64LFCSP
AD9238BCPZRL-20-ND - IC ADC 12BIT DUAL 20MSPS 64LFCSP
AD9238BCPZRL-40-ND - IC ADC 12BIT DUAL 40MSPS 64LFCSP
AD9238BSTZ-40-ND - IC ADC 12BIT DUAL 40MSPS 64-LQFP
AD9238BSTRL-40-ND - IC ADC 12BIT DUAL 40MSPS 64-LQFP
AD9238BST-40-ND - IC ADC 12BIT DUAL 40MSPS 64-LQFP
AD9238
Rev. C | Page 44 of 48
02640-
077
Figure 58. PCB Bottom-Side Silkscreen
02640-
078
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when locally
attached to a ground plane at the PCB. A thermal (filled) via array
to a ground plane beneath the part provides a path for heat to
escape the package, lowering junction temperature. Improved
electrical performance also results from the reduction in package
parasitics due to proximity of the ground plane. Recommended
array is 0.3 mm vias on 1.2 mm pitch. θJA = 26.4°C/W with this
recommended configuration. Soldering the slug to the PCB is a
requirement for this package.
Figure 59. Thermal Via Array
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相關(guān)代理商/技術(shù)參數(shù)
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AD9238BCPZ-20EB 制造商:AD 制造商全稱:Analog Devices 功能描述:12-Bit, 20 MSPS/40 MSPS/65 MSPS Dual A/D Converter
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