參數(shù)資料
型號: AD9278-50EBZ
廠商: Analog Devices Inc
文件頁數(shù): 44/44頁
文件大?。?/td> 0K
描述: BOARD EVALUATION FOR AD9278
標準包裝: 1
ADC 的數(shù)量: 8
位數(shù): 12
采樣率(每秒): 10M ~ 50M
數(shù)據(jù)接口: 串行
輸入范圍: *
在以下條件下的電源(標準): *
工作溫度: -40°C ~ 85°C
已用 IC / 零件: AD9278
已供物品:
Data Sheet
AD9278
Rev. A | Page 9 of 44
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
AVDD1 to GND
0.3 V to +2.0 V
AVDD2 to GND
0.3 V to +3.9 V
DRVDD to GND
0.3 V to +2.0 V
GND to GND
0.3 V to +0.3 V
AVDD2 to AVDD1
2.0 V to +3.9 V
AVDD1 to DRVDD
2.0 V to +2.0 V
AVDD2 to DRVDD
2.0 V to +3.9 V
Digital Outputs (DOUTx+, DOUTx,
DCO+, DCO, FCO+, FCO) to GND
0.3 V to
DRVDD + 0.3 V
CLK+, CLK, SDIO to GND
0.3 V to
AVDD1 + 0.3 V
LI-x, LO-x, LOSW-x to GND
0.3 V to
AVDD2 + 0.3 V
CWI, CWI+, CWQ, CWQ+ to GND
0.3 V to
AVDD2 + 0.3 V
PDWN, STBY, SCLK, CSB to GND
0.3 V to
AVDD1 + 0.3 V
GAIN+, GAIN, RESET, 4LO+, 4LO,
GPO0, GPO1, GPO2, GPO3 to GND
0.3 V to
AVDD2 + 0.3 V
VREF to GND
0.3 V to
AVDD1 + 0.3 V
Operating Temperature Range (Ambient)
40°C to +85°C
Storage Temperature Range (Ambient)
65°C to +150°C
Maximum Junction Temperature
150°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Symbol
Description
Value1
Units
θJA
Junction-to-ambient thermal
resistance, 0.0 m/s air flow per
JEDEC JESD51-2 (still air)
22.0
°C/W
ΨJB
Junction-to-board thermal
characterization parameter, 0 m/s
air flow per JEDEC JESD51-8 (still air)
9.2
°C/W
ΨJT
Junction-to-top-of-package
characterization parameter, 0 m/s
air flow per JEDEC JESD51-2 (still air)
0.12
°C/W
1
Results are from simulations. PCB is JEDEC multilayer. Thermal performance
for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these
calculations.
ESD CAUTION
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