參數(shù)資料
型號: AD9709-EBZ
廠商: Analog Devices Inc
文件頁數(shù): 12/32頁
文件大小: 0K
描述: BOARD EVAL FOR AD9709
產(chǎn)品培訓(xùn)模塊: DAC Architectures
標(biāo)準(zhǔn)包裝: 1
系列: TxDAC®
DAC 的數(shù)量: 2
位數(shù): 8
采樣率(每秒): 125M
數(shù)據(jù)接口: 并聯(lián)
設(shè)置時(shí)間: 35ns
DAC 型: 電流
工作溫度: -40°C ~ 85°C
已供物品:
已用 IC / 零件: AD9709
相關(guān)產(chǎn)品: AD9709ASTZRL-ND - IC DAC 8BIT DUAL 125MSPS 48LQFP
AD9709ASTZ-ND - IC DAC 8BIT DUAL 125MSPS 48-LQFP
AD9709
Rev. B | Page 2 of 32
TABLE OF CONTENTS
REVISION HISTORY
9/09—Rev. A to Rev. B
Changes to Power and Grounding Considerations Section ..... 20
Changes to Schematics Section..................................................... 24
Changes to Evaluation Board Layout Section............................. 30
1/08—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changed Single Supply Operation to 5 V or 3.3 V ........Universal
Changes to Figure 1.......................................................................... 1
Added Timing Diagram Section .................................................... 5
Changes to Figure 3 and Table 6..................................................... 7
Change to Figure 12 ......................................................................... 9
Changes to Figure 18 to Figure 20................................................ 10
Changes to Functional Description Section ............................... 13
Changes to Reference Operation Section.................................... 13
Changes to Figure 23 and Figure 24............................................. 13
Changes to Gain Control Mode Section...................................... 13
Replaced Reference Control Amplifier Section with Setting
the Full-Scale Current Section...................................................... 13
Changes to DAC Transfer Function Section............................... 14
Changes to Interleaved Mode Timing Section ........................... 16
Added Figure 28 ............................................................................. 16
Changes to Power and Grounding Considerations Section ..... 20
Changes to Figure 44...................................................................... 22
Deleted Figure 43............................................................................ 17
Changes to CDMA Section ........................................................... 23
Changes to Figure 45 Caption ...................................................... 23
Changes to Figure 46...................................................................... 24
Changes to Figure 48...................................................................... 26
Updated Outline Dimensions....................................................... 30
Changes to Ordering Guide .......................................................... 30
5/00—Revision 0: Initial Version
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