參數(shù)資料
型號: AD9709-EBZ
廠商: Analog Devices Inc
文件頁數(shù): 29/32頁
文件大?。?/td> 0K
描述: BOARD EVAL FOR AD9709
產(chǎn)品培訓(xùn)模塊: DAC Architectures
標(biāo)準(zhǔn)包裝: 1
系列: TxDAC®
DAC 的數(shù)量: 2
位數(shù): 8
采樣率(每秒): 125M
數(shù)據(jù)接口: 并聯(lián)
設(shè)置時間: 35ns
DAC 型: 電流
工作溫度: -40°C ~ 85°C
已供物品:
已用 IC / 零件: AD9709
相關(guān)產(chǎn)品: AD9709ASTZRL-ND - IC DAC 8BIT DUAL 125MSPS 48LQFP
AD9709ASTZ-ND - IC DAC 8BIT DUAL 125MSPS 48-LQFP
AD9709
Rev. B | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
THERMAL RESISTANCE
Parameter
With
Respect To
Rating
AVDD
ACOM
0.3 V to +6.5 V
DVDD1, DVDD2
DCOM1/DCOM2
0.3 V to +6.5 V
ACOM
DCOM1/DCOM2
0.3 V to +0.3 V
AVDD
DVDD1/DVDD2
6.5 V to +6.5 V
MODE, CLK1/IQCLK,
CLK2/IQRESET,
WRT1/IQWRT,
WRT2/IQSEL
DCOM1/DCOM2
0.3 V to DVDD1/
DVDD2 + 0.3 V
Digital Inputs
DCOM1/DCOM2
0.3 V to DVDD1/
DVDD2 + 0.3 V
IOUTA1/IOUTA2,
IOUTB1/IOUTB2
ACOM
1.0 V to AVDD + 0.3 V
REFIO, FSADJ1,
FSADJ2
ACOM
0.3 V to AVDD + 0.3 V
GAINCTRL, SLEEP
ACOM
0.3 V to AVDD + 0.3 V
Junction Temperature
150°C
Storage Temperature
Range
65°C to +150°C
Lead Temperature
(10 sec)
300°C
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
θJA
Unit
48-Lead LQFP
91
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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