參數(shù)資料
型號: AD9734BBCZRL
廠商: Analog Devices Inc
文件頁數(shù): 27/72頁
文件大小: 0K
描述: IC DAC 10BIT 1.2GSPS 160-CSPBGA
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 1,500
位數(shù): 10
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 模擬和數(shù)字
功率耗散(最大): 550mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 160-LFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 160-CSPBGA(12x12)
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 2 電流,單極
采樣率(每秒): 1.2G
AD9734/AD9735/AD9736
Rev. A | Page 33 of 72
ANALOG CONTROL (ANA_CNT) REGISTERS (REG. 14, REG. 15)
ADDR
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0x0E
ANA_CNT1
MSEL<1>
MSEL<0>
TRMBG<2>
TRMBG<1>
TRMBG<0>
0x0F
ANA_CNT2
HDRM<7>
HDRM<6>
HDRM<5>
HDRM<4>
HDRM<3>
HDRM<2>
HDRM<1>
HDRM<0>
Table 16. Analog Control Register Bit Descriptions
Bit Name
Read/Write
Description
MSEL<1:0>
WRITE
00, mirror roll off frequency control = bypass.
01, mirror roll off frequency control = narrowest bandwidth.
10, mirror roll off frequency control = medium bandwidth.
11
, mirror roll off frequency control = widest bandwidth.
NOTE: See the plot in the Analog Control Registers section.
TRMBG<2:0>
WRITE
000
, band gap temperature characteristic trim.
NOTE: See the plot in the Analog Control Registers section.
HDRM<7:0>
WRITE
0xCA, output stack headroom control.
HDRM<7:4> set reference offset from AVDD33 (VCAS centering).
HDRM<3:0> set overdrive (current density) trim (temperature tracking).
Note: Set to 0xCA for optimum performance.
BUILT-IN SELF TEST CONTROL (BIST_CNT) REGISTERS (REG. 17, REG. 18, REG. 19, REG. 20, REG. 21)
ADDR
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0x11
BIST_CNT
SEL<1>
SEL<0>
SIG_READ
LVDS_EN
SYNC_EN
CLEAR
0x12
BIST<7:0>
BIST<7>
BIST<6>
BIST<5>
BIST<4>
BIST<3>
BIST<2>
BIST<1>
BIST<0>
0x13
BIST<15:8>
BIST<15>
BIST<14>
BIST<13>
BIST<12>
BIST<11>
BIST<10>
BIST<9>
BIST<8>
0x14
BIST<23:16>
BIST<23>
BIST<22>
BIST<21>
BIST<20>
BIST<19>
BIST<18>
BIST<17>
BIST<16>
0x15
BIST<31:24>
BIST<31>
BIST<30>
BIST<29>
BIST<28>
BIST<27>
BIST<26>
BIST<25>
BIST<24>
Table 17. BIST Control Register Bit Descriptions
Bit Name
Read/Write
Description
SEL<1:0>
WRITE
00, write result of the LVDS Phase 1 BIST to BIST<31:0>.
01, write result of the LVDS Phase 2 BIST to BIST<31:0>.
10, write result of the SYNC Phase 1 BIST to BIST<31:0>.
11, write result of the SYNC Phase 2 BIST to BIST<31:0>.
SIG_READ
WRITE
0, no action.
1, enable BIST signature readback.
LVDS_EN
WRITE
0, no action.
1, enable LVDS BIST.
SYNC_EN
WRITE
0, no action.
1, enable SYNC BIST.
CLEAR
WRITE
0, no action.
1, clear all BIST registers.
BIST<31:0>
READ
Results of the built-in self test.
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