TMIN to TMAX
參數(shù)資料
型號(hào): ADF4001BRU-REEL
廠商: Analog Devices Inc
文件頁數(shù): 11/17頁
文件大小: 0K
描述: IC CLOCK GEN PLL 16-TSSOP
標(biāo)準(zhǔn)包裝: 2,500
類型: 時(shí)鐘發(fā)生器(RF)
PLL:
輸入: 時(shí)鐘
輸出: 時(shí)鐘
電路數(shù): 1
比率 - 輸入:輸出: 2:1
差分 - 輸入:輸出: 是/無
頻率 - 最大: 200MHz
除法器/乘法器: 是/無
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 帶卷 (TR)
REV.
–3–
ADF4001
TIMING CHARACTERISTICS
Limit at
TMIN to TMAX
Parameter
(B Version)
Unit
Test Conditions/Comments
t1
10
ns min
DATA to CLOCK Setup Time
t2
10
ns min
DATA to CLOCK Hold Time
t3
25
ns min
CLOCK High Duration
t4
25
ns min
CLOCK Low Duration
t5
10
ns min
CLOCK to LE Setup Time
t6
20
ns min
LE Pulsewidth
Guaranteed by design but not production tested.
Specifications subject to change without notice.
(AVDD = DVDD = 3 V
10%, 5 V
10%; AVDD
≤ VP ≤ 6.0 V ; AGND = DGND = CPGND= 0 V;
RSET = 4.7 k ; TA = TMIN to TMAX, unless otherwise noted; dBm referred to 50
.)
t1
t2
t3
t4
t6
t5
DB20
(MSB)
DB19
DB2
DB1
(CONTROL BIT C2)
CLOCK
DATA
LE
DB0 (LSB)
(CONTROL BIT C1)
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A = 25
°C, unless otherwise noted.)
AVDD to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +0.3 V
VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . . –0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to VP + 0.3 V
REFIN, RFINA, RFINB to GND . . . . . . . –0.3 V to VDD + 0.3 V
RFINA to RFINB . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
mV
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150
°C
TSSOP
θJA Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W
LFCSP
θJA Thermal Impedance (Paddle Soldered) . . 122°C/W
LFCSP
θ
JA Thermal Impedance (Paddle Not Soldered)
216
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2This device is a high performance RF integrated circuit with an ESD rating of
<2 k
and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3GND = AGND = DGND = 0 V.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
B
600
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