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ADG5208/ADG5209
Data Sheet
Rev. A | Page 10 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
A0
1
EN
2
VSS 3
S1
4
A1
16
A2
15
GND
14
VDD
13
S2
5
S5
12
S3
6
S6
11
S4
7
S7
10
D
8
S8
9
ADG5208
TOP VIEW
(Not to Scale)
09917-
002
12
11
10
1
3
4
GND
VDD
S5
9
S6
VSS
S2
2
S1
S3
6
D
5
S4
7
S8
8
S7
16
EN
15
A0
14
A1
13
A2
TOP VIEW
(Not to Scale)
ADG5208
NOTES
1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE SOLDER JOINTS AND
MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, VSS.
09917-
003
Pin No.
TSSOP
LFCSP
Mnemonic
Description
1
15
A0
Logic Control Input.
2
16
EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high, the
Ax logic inputs determine the on switches.
3
1
VSS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
4
2
S1
Source Terminal 1. This pin can be an input or an output.
5
3
S2
Source Terminal 2. This pin can be an input or an output.
6
4
S3
Source Terminal 3. This pin can be an input or an output.
7
5
S4
Source Terminal 4. This pin can be an input or an output.
8
6
D
Drain Terminal. This pin can be an input or an output.
9
7
S8
Source Terminal 8. This pin can be an input or an output.
10
8
S7
Source Terminal 7. This pin can be an input or an output.
11
9
S6
Source Terminal 6. This pin can be an input or an output.
12
10
S5
Source Terminal 5. This pin can be an input or an output.
13
11
VDD
Most Positive Power Supply Potential.
14
12
GND
Ground (0 V) Reference.
15
13
A2
Logic Control Input.
16
14
A1
Logic Control Input.
EP
Exposed Pad
The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
A2
A1
A0
EN
On Switch
0
None
0
1
0
1
2
0
1
0
1
3
0
1
4
1
0
1
5
1
0
1
6
1
0
1
7
1
8
1
X is don’t care.