2-70 Revision 4 Table 2-32 RAM512X18 Commercial Temperature Range Conditions: T
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� AFS090-1QNG108I
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 320/334闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA 2MB FLASH 90K 108-QFN
妯欐簴鍖呰锛� 348
绯诲垪锛� Fusion®
RAM 浣嶇附瑷堬細 27648
杓稿叆/杓稿嚭鏁�(sh霉)锛� 37
闁€鏁�(sh霉)锛� 90000
闆绘簮闆诲锛� 1.425 V ~ 1.575 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� -40°C ~ 100°C
灏佽/澶栨锛� 108-WFQFN
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 108-QFN锛�8x8锛�
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�绗�143闋�绗�144闋�绗�145闋�绗�146闋�绗�147闋�绗�148闋�绗�149闋�绗�150闋�绗�151闋�绗�152闋�绗�153闋�绗�154闋�绗�155闋�绗�156闋�绗�157闋�绗�158闋�绗�159闋�绗�160闋�绗�161闋�绗�162闋�绗�163闋�绗�164闋�绗�165闋�绗�166闋�绗�167闋�绗�168闋�绗�169闋�绗�170闋�绗�171闋�绗�172闋�绗�173闋�绗�174闋�绗�175闋�绗�176闋�绗�177闋�绗�178闋�绗�179闋�绗�180闋�绗�181闋�绗�182闋�绗�183闋�绗�184闋�绗�185闋�绗�186闋�绗�187闋�绗�188闋�绗�189闋�绗�190闋�绗�191闋�绗�192闋�绗�193闋�绗�194闋�绗�195闋�绗�196闋�绗�197闋�绗�198闋�绗�199闋�绗�200闋�绗�201闋�绗�202闋�绗�203闋�绗�204闋�绗�205闋�绗�206闋�绗�207闋�绗�208闋�绗�209闋�绗�210闋�绗�211闋�绗�212闋�绗�213闋�绗�214闋�绗�215闋�绗�216闋�绗�217闋�绗�218闋�绗�219闋�绗�220闋�绗�221闋�绗�222闋�绗�223闋�绗�224闋�绗�225闋�绗�226闋�绗�227闋�绗�228闋�绗�229闋�绗�230闋�绗�231闋�绗�232闋�绗�233闋�绗�234闋�绗�235闋�绗�236闋�绗�237闋�绗�238闋�绗�239闋�绗�240闋�绗�241闋�绗�242闋�绗�243闋�绗�244闋�绗�245闋�绗�246闋�绗�247闋�绗�248闋�绗�249闋�绗�250闋�绗�251闋�绗�252闋�绗�253闋�绗�254闋�绗�255闋�绗�256闋�绗�257闋�绗�258闋�绗�259闋�绗�260闋�绗�261闋�绗�262闋�绗�263闋�绗�264闋�绗�265闋�绗�266闋�绗�267闋�绗�268闋�绗�269闋�绗�270闋�绗�271闋�绗�272闋�绗�273闋�绗�274闋�绗�275闋�绗�276闋�绗�277闋�绗�278闋�绗�279闋�绗�280闋�绗�281闋�绗�282闋�绗�283闋�绗�284闋�绗�285闋�绗�286闋�绗�287闋�绗�288闋�绗�289闋�绗�290闋�绗�291闋�绗�292闋�绗�293闋�绗�294闋�绗�295闋�绗�296闋�绗�297闋�绗�298闋�绗�299闋�绗�300闋�绗�301闋�绗�302闋�绗�303闋�绗�304闋�绗�305闋�绗�306闋�绗�307闋�绗�308闋�绗�309闋�绗�310闋�绗�311闋�绗�312闋�绗�313闋�绗�314闋�绗�315闋�绗�316闋�绗�317闋�绗�318闋�绗�319闋�鐣跺墠绗�320闋�绗�321闋�绗�322闋�绗�323闋�绗�324闋�绗�325闋�绗�326闋�绗�327闋�绗�328闋�绗�329闋�绗�330闋�绗�331闋�绗�332闋�绗�333闋�绗�334闋�
Device Architecture
2-70
Revision 4
Table 2-32 RAM512X18
Commercial Temperature Range Conditions: TJ = 70掳C, Worst-Case VCC = 1.425 V
Parameter
Description
鈥�2
鈥�1
Std.
Units
tAS
Address setup time
0.25 0.28
0.33
ns
tAH
Address hold time
0.00 0.00
0.00
ns
tENS
REN, WEN setup time
0.09 0.10
0.12
ns
tENH
REN, WEN hold time
0.06 0.07
0.08
ns
tDS
Input data (WD) setup time
0.18 0.21
0.25
ns
tDH
Input data (WD) hold time
0.00 0.00
0.00
ns
tCKQ1
Clock High to new data valid on RD (output retained)
2.16 2.46
2.89
ns
tCKQ2
Clock High to new data valid on RD (pipelined)
0.90 1.02
1.20
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on
same address鈥擜pplicable to Opening Edge
0.50 0.43
0.38
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on
same address鈥� Applicable to Opening Edge
0.59 0.50
0.44
ns
tRSTBQ1
RESET Low to data out Low on RD (flow-through)
0.92 1.05
1.23
ns
RESET Low to data out Low on RD (pipelined)
0.92 1.05
1.23
ns
tREMRSTB
RESET removal
0.29 0.33
0.38
ns
tRECRSTB
RESET recovery
1.50 1.71
2.01
ns
tMPWRSTB
RESET minimum pulse width
0.21 0.24
0.29
ns
tCYC
Clock cycle time
3.23 3.68
4.32
ns
FMAX
Maximum frequency
310
272
231
MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
2. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
EP4CE22E22I7N IC CYCLONE IV FPGA 22K 144EQFP
EP4CE22E22C6N IC CYCLONE IV FPGA 22K 144EQFP
A40MX04-VQ80I IC FPGA MX SGL CHIP 6K 80-VQFP
A40MX04-1VQ80 IC FPGA MX SGL CHIP 6K 80-VQFP
EPF6016ATC144-1N IC FLEX 6000 FPGA 16K 144-TQFP
鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
AFS090-1QNG180 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 90K 180-QFN RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:Fusion® 妯欐簴鍖呰:152 绯诲垪:IGLOO PLUS LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):792 RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):120 闁€鏁�(sh霉):30000 闆绘簮闆诲:1.14 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 85°C 灏佽/澶栨:289-TFBGA锛孋SBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:289-CSP锛�14x14锛�
AFS090-1QNG180I 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 90K 180-QFN RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:Fusion® 妯欐簴鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
AFS090-1QNG256ES 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs
AFS090-1QNG256I 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs
AFS090-1QNG256PP 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs