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參數(shù)資料
| 型號： | AG302-86G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 447K |
| 代理商： | AG302-86G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 6 of 6 June 2005
AG302-86
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
AG302-86G (Green / Lead-free Sot-86 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
q
C reflow temperature) and leaded
(maximum 245
q
C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
Rating
-40 to +85
q
C
310
q
C/W
131
q
C
Product Marking
The component will be marked with an
“W” designator followed by a two-digit
numeric lot code on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this d
evice. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Pin Temperature
1
10
100
1000
60
70
80
90
100
110
GND Pin Temperature (°C)
M
相關PDF資料 |
PDF描述 |
|---|---|
| AG303-63G | InGaP HBT Gain Block |
| AG303-86G | InGaP HBT Gain Block |
| AG303-86-RFID | InGaP HBT Gain Block |
| AG402-86G | InGaP HBT Gain Block |
| AG402-86PCB | InGaP HBT Gain Block |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AG302-86PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 13.5dBm 15.5dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AG302-86TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG303 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| AG303-63 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| AG303-63G | 功能描述:射頻放大器 DC-6000MHz 20.5dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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