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參數(shù)資料
| 型號： | AG303-86G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 500K |
| 代理商： | AG303-86G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 1 of 6 June 2005
AG303-86
InGaP HBT Gain Block
Product Information
Product Features
DC – 6000 MHz
+14 dBm P1dB at 900 MHz
+26 dBm OIP3 at 900 MHz
20.5 dB Gain at 900 MHz
Single Voltage Supply
Green SOT-86 SMT Package
Internally matched to 50
Applications
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
Specifications
(1)
Product Description
The AG303-86 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG303-86 typically provides
20.5 dB gain, +26 dBm OIP3, and +14 dBm P1dB. The
device combines dependable performance with consistent
quality to maintain MTTF values exceeding 100 years at
mounting temperatures of +85
°
C & is housed in a SOT-86
(micro-X) industry-standard SMT lead-free/green/RoHS-
compliant package.
The AG303-86 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG303-86 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
GND
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output IP3
(2)
Output IP2
Output P1dB
Noise Figure
Test Frequency
Gain
Output IP3
(2)
Output P1dB
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
Typ
900
20.4
-22
-20
+14.0
+26.1
+34
3.0
1900
18.1
+24.8
+12.7
4.23
35
Max
6000
17.1
19.1
1. Test conditions: T = 25o C, Supply Voltage = +5 V, R
bias
= 22.1
, 50
System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The suppression
on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. The junction temperature ensures a minimum MTTF rating of 1 million hours of usage.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85
°
C
-55 to +125
°
C
+5 V
+10 dBm
+250
°
C
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance
(1)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
900
20.4
-22
-20
+14.0
+26.1
3.0
500
21.1
-21
-22
+14.0
+26.4
2.9
1900
18.1
-26
-16
+12.7
+24.8
3.2
2140
17.5
-25
-16
+12.4
+24.4
3.2
Ordering Information
Part No.
AG303-86*
Description
InGaP HBT Gain Block
(lead-tin SOT-86 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 Pkg)
700 – 2400 MHz Fully Assembled Eval. Board
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
AG303-86G
AG303-86PCB
RF Out
RF In
GND
1
2
3
4
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AG303-86-RFID | InGaP HBT Gain Block |
| AG402-86G | InGaP HBT Gain Block |
| AG402-86PCB | InGaP HBT Gain Block |
| AG402-86-RFID | InGaP HBT Gain Block |
| AG402-86 | Gain Blocks |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AG303-86PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 14dBm 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AG303-86-RFID | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| AG303-86TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG30N-5 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態(tài):有效 類型:高電壓 - 隔離模塊 輸出數(shù):1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:5V 電壓 - 輸出 1:-3000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:330μA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應(yīng)用:ITE（商業(yè)） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標準包裝:1 |
| AG30P-12 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態(tài):有效 類型:高電壓 - 隔離模塊 輸出數(shù):1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:12V 電壓 - 輸出 1:3000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:330μA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應(yīng)用:ITE（商業(yè)） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標準包裝:1 |
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