參數(shù)資料
型號(hào): AGL10005-FFGG144
元件分類: FPGA
英文描述: FPGA, 1000000 GATES, 250 MHz, PBGA144
封裝: 13 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-144
文件頁(yè)數(shù): 177/204頁(yè)
文件大?。?/td> 2800K
代理商: AGL10005-FFGG144
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)當(dāng)前第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)
IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology
2- 60
Advanced v0.1
JTAG Pins
IGLOO devices have a separate bank for the dedicated
JTAG pins. The JTAG pins can be run at any voltage from
1.5 V to 3.3 V (nominal). VCC must also be powered for
the JTAG state machine to operate, even if the device is
in bypass mode; VJTAG alone is insufficient. Both VJTAG
and VCC to the IGLOO part must be supplied to allow
JTAG signals to transition the IGLOO device. Isolating the
JTAG power supply in a separate I/O bank gives greater
flexibility in supply selection and simplifies power supply
and PCB design. If the JTAG interface is neither used nor
planned for use, the VJTAG pin together with the TRST
pin could be tied to GND.
TCK
Test Clock
Test clock input for JTAG boundary scan, ISP, and UJTAG.
The TCK pin does not have an internal pull-up/-down
resistor. If JTAG is not used, Actel recommends tying off
TCK to GND through a resistor placed close to the FPGA
pin. This prevents JTAG operation in case TMS enters an
undesired state.
Note that to operate at all VJTAG voltages, 500 Ω to 1 kΩ
will satisfy the requirements. Refer to Table 2-33 for
more information.
TDI
Test Data Input
Serial input for JTAG boundary scan, ISP, and UJTAG
usage. There is an internal weak pull-up resistor on the
TDI pin.
TDO
Test Data Output
Serial output for JTAG boundary scan, ISP, and UJTAG
usage.
TMS
Test Mode Select
The TMS pin controls the use of the IEEE 1532 boundary
scan pins (TCK, TDI, TDO, TRST). There is an internal weak
pull-up resistor on the TMS pin.
TRST
Boundary Scan Reset Pin
The TRST pin functions as an active low input to
asynchronously initialize (or reset) the boundary scan
circuitry. There is an internal weak pull-up resistor on the
TRST pin. If JTAG is not used, an external pull-down
resistor could be included to ensure the test access port
(TAP) is held in reset mode. The resistor values must be
chosen from Table 2-33 and must satisfy the parallel
resistance value requirement. The values in Table 2-33
correspond to the resistor recommended when a single
device is used and the equivalent parallel resistor when
multiple devices are connected via a JTAG chain.
In critical applications, an upset in the JTAG circuit could
allow entrance to an undesired JTAG state. In such cases,
Actel recommends tying off TRST to GND through a
resistor placed close to the FPGA pin.
Note that to operate at all VJTAG voltages, 500 Ω to 1 kΩ
will satisfy the requirements.
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device.
These pins can be driven to any voltage or can be left
floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the
PCB. These pins should be left unconnected.
Table 2-33 Recommended Tie-Off Values for the TCK and
TRST Pins
VJTAG
Tie-Off Resistance
VJTAG at 3.3 V
200
Ω to 1 kΩ
VJTAG at 2.5 V
200
Ω to 1 kΩ
VJTAG at 1.8 V
500
Ω to 1 kΩ
VJTAG at 1.5 V
500
Ω to 1 kΩ
Notes:
1. Equivalent parallel resistance if more than one device is on
the JTAG chain.
2. The TCK pin can be pulled up/down.
3. The TRST pin is pulled down.
相關(guān)PDF資料
PDF描述
AGL10005-FFGG256I FPGA, 1000000 GATES, 250 MHz, PBGA144
AGL10005-FFGG256 FPGA, 1000000 GATES, 250 MHz, PBGA144
AGL10005-FFGG484I FPGA, 1000000 GATES, 250 MHz, PBGA484
AGL10005-FFGG484 FPGA, 1000000 GATES, 250 MHz, PBGA484
AGL10005-FG144 FPGA, 1000000 GATES, 250 MHz, PBGA144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGL1000V2-CS144 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS144ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS144I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS144PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS281 功能描述:IC FPGA 1KB FLASH 1M 281-CSP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)