參數(shù)資料
型號(hào): AGL10005-FFGG144
元件分類: FPGA
英文描述: FPGA, 1000000 GATES, 250 MHz, PBGA144
封裝: 13 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-144
文件頁(yè)數(shù): 180/204頁(yè)
文件大?。?/td> 2800K
代理商: AGL10005-FFGG144
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)當(dāng)前第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)
IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology
A d v an c ed v0 . 1
2-63
JTAG 1532
IGLOO devices support the JTAG-based IEEE 1532
standard for ISP. In order to start JTAG operations the
IGLOO device should exit Flash*Freeze mode and be in
normal operation for before starting to send JTAG
commands to the device. As part of this support, when a
IGLOO device is in an unprogrammed state, all user I/O
pins are disabled. This is achieved by keeping the global
IO_EN signal deactivated, which also has the effect of
disabling the input buffers. The SAMPLE/PRELOAD
instruction captures the status of pads in parallel and
shifts them out as new data is shifted in for loading into
the Boundary Scan Register. When the IGLOO device is in
an
unprogrammed
state,
the
SAMPLE/PRELOAD
instruction has no effect on I/O status; however, it will
continue to shift in new data to be loaded into the BSR.
Therefore, when SAMPLE/PRELOAD is used on an
unprogrammed device, the BSR will be loaded with
undefined data.
For JTAG timing information on setup, hold, and fall
times, refer to the FlashPro User’s Guide.
Boundary Scan
IGLOO devices are compatible with IEEE Standard 1149.1,
which defines a hardware architecture and the set of
mechanisms for boundary scan testing. JTAG operations
are used during boundary scan testing; therefore, the
Flash*Freeze pin must be deasserted for successful
boundary scan operations. The basic IGLOO boundary
scan logic circuit is composed of the TAP controller, test
data registers, and instruction register (Figure 2-45 on
page 2-65). This circuit supports all mandatory IEEE
1149.1 instructions (EXTEST, SAMPLE/PRELOAD, and
BYPASS) and the optional IDCODE instruction (Table 2-
34).
Each test section is accessed through the TAP, which has
five associated pins: TCK (test clock input), TDI, TDO (test
data input and output), TMS (test mode selector), and
TRST (test reset input). TMS, TDI, and TRST are equipped
with pull-up resistors to ensure proper operation when
no input data is supplied to them. These pins are
dedicated for boundary scan test usage. Refer to the
recommendations for TDO and TCK pins. Table 2-35 gives
pull-down recommendations for the TRST and TCK
pins.
Table 2-34 Boundary Scan Opcodes
Hex Opcode
EXTEST
00
HIGHZ
07
USERCODE
0E
SAMPLE/PRELOAD
01
IDCODE
0F
CLAMP
05
BYPASS
FF
Table 2-35 TRST and TCK Pull-Down Recommendations
VJTAG
Tie-Off Resistance*
VJTAG at 3.3 V
200
Ω to 1 kΩ
VJTAG at 2.5 V
200
Ω to 1 kΩ
VJTAG at 1.8 V
500
Ω to 1 kΩ
VJTAG at 1.5 V
500
Ω to 1 kΩ
Note: *Equivalent parallel resistance if more than one device
is on JTAG chain (Figure 2-43)
Note: TCK is correctly wired with an equivalent tie-off resistance
of 500
Ω, which satisfies the table for V
JTAG of 1.5 V. The
resistor values for TRST are not appropriate in this case, as
the tie-off resistance of 375
Ω is below the recommended
minimum for VJTAG = 1.5 V, but would be appropriate for a
VJTAG setting of 2.5 V or 3.3 V.
Figure 2-43 Parallel Resistance on JTAG Chain of Devices
TDI
TDO
JTAG
Header
Actel
FPGA 1
Actel
FPGA 2
Actel
FPGA 3
Actel
FPGA 4
2 k
Ω
2 k
Ω
2 k
Ω
2 k
Ω
1.5 V
TCK
TRST
VJTAG
GND
1.5 k
Ω
1.5 k
Ω
1.5 k
Ω
1.5 k
Ω
相關(guān)PDF資料
PDF描述
AGL10005-FFGG256I FPGA, 1000000 GATES, 250 MHz, PBGA144
AGL10005-FFGG256 FPGA, 1000000 GATES, 250 MHz, PBGA144
AGL10005-FFGG484I FPGA, 1000000 GATES, 250 MHz, PBGA484
AGL10005-FFGG484 FPGA, 1000000 GATES, 250 MHz, PBGA484
AGL10005-FG144 FPGA, 1000000 GATES, 250 MHz, PBGA144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGL1000V2-CS144 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS144ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS144I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS144PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology
AGL1000V2-CS281 功能描述:IC FPGA 1KB FLASH 1M 281-CSP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)