2-26 Revision 13 Table 2-26 Summary of I/O Timing Characteristics—Software Default Settings
參數(shù)資料
型號(hào): AGLE3000V5-FGG896
廠商: Microsemi SoC
文件頁數(shù): 102/166頁
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝: 27
系列: IGLOOe
邏輯元件/單元數(shù): 75264
RAM 位總計(jì): 516096
輸入/輸出數(shù): 620
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 896-BGA
供應(yīng)商設(shè)備封裝: 896-FBGA(31x31)
IGLOOe DC and Switching Characteristics
2-26
Revision 13
Table 2-26 Summary of I/O Timing Characteristics—Software Default Settings
Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V,
Worst-Case VCCI (per standard)
I/O Standard
Drive
S
trength
(mA)
Eq
uivalen
tSo
ft
ware
De
fault
Drive
S
trength
Option
1 (mA)
Slew
Rat
e
Ca
p
acitive
Lo
ad
(p
F)
Ex
te
rn
al
R
esi
st
or
(
)
t DO
UT
(ns)
t DP
(ns)
t DI
N
(ns)
t PY
(ns)
t PYS
(ns)
t EOUT
(ns)
t ZL
(ns)
t ZH
(ns)
t LZ
(ns)
t HZ
(ns)
t ZLS
(ns)
t ZH
S
(ns)
Unit
s
3.3 V LVTTL /
3.3 V LVCMOS
12
12 High 5
1.55 2.47 0.26 1.31 1.58 1.10 2.51 2.04 3.28 3.97 8.29 7.82 ns
3.3 V LVCMOS
Wide Range1,2
100 A 12 High 35
1.55 3.40 0.26 1.66 2.14 1.10 3.40 2.68 4.55 5.49 9.19 8.46 ns
2.5 V LVCMOS
12
12 High 5
1.55 2.51 0.26 1.55 1.77 1.10 2.54 2.22 3.36 3.85 8.33 8.00 ns
1.8 V LVCMOS
12
12 High 5
1.55 2.75 0.26 1.53 1.96 1.10 2.78 2.40 3.68 4.56 8.57 8.19 ns
1.5 V LVCMOS
12
12 High 5
1.55 3.10 0.26 1.72 2.16 1.10 3.15 2.70 3.86 4.68 8.93 8.49 ns
1.2 V LVCMOS
2
High 5
1.55 4.06 0.26 2.09 2.95 1.10 3.92 3.46 4.01 3.79 9.71 9.24 ns
1.2 V LVCMOS
Wide Range1,3
100 A
2
High 5
1.55 4.06 0.26 2.09 2.95 1.10 3.92 3.46 4.01 3.79 9.71 9.24 ns
3.3 V PCI
PerPCI
spec
High 10
254 1.55 2.76 0.26 1.19 1.63 1.10 2.79 2.16 3.29 3.97 8.58 7.94 ns
3.3 V PCI-X
Per
PCI-X
spec
High 10
254 1.55 2.76 0.25 1.22 1.58 1.10 2.79 2.16 3.29 3.97 8.58 7.94 ns
3.3 V GTL
205
High 10
25 1.55 2.08 0.25 2.76
1.10 2.09 2.08
7.88 7.87 ns
2.5 V GTL
205
High 10
25 1.55 2.17 0.25 2.35
1.10 2.20 2.13
7.99 7.91 ns
3.3 V GTL+
35
High 10
25 1.55 2.12 0.25 1.62
1.10 2.14 2.07
7.93 7.85 ns
2.5 V GTL+
33
High 10
25 1.55 2.25 0.25 1.55
1.10 2.27 2.10
8.06 7.89 ns
HSTL (I)
8
High 20
50 1.55 3.09 0.25 1.95
1.10 3.11 3.09
8.90 8.88 ns
HSTL (II)
15
High 20
25 1.55 2.94 0.25 1.95
1.10 2.98 2.74
8.77 8.53 ns
SSTL2 (I)
15
High 30
50 1.55 2.18 0.25 1.40
1.10 2.21 2.03
7.99 7.82 ns
SSTL2 (II)
18
High 30
25 1.55 2.21 0.25 1.40
1.10 2.24 1.97
8.03 7.76 ns
SSTL3 (I)
14
High 30
50 1.55 2.33 0.25 1.33
1.10 2.36 2.02
8.15 7.81 ns
SSTL3 (II)
21
High 30
25 1.55 2.13 0.25 1.33
1.10 2.16 1.89
7.94 7.67 ns
Notes:
1. The minimum drive strength for any LVCMOS 1.2 V or LVCMOS 3.3 V software configuration when run in wide range is
±100 A. Drive strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the
IBIS models.
2. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
3. All LVCMOS 1.2 V software macros support LVCMOS 1.2 V wide range as specified in the JESD8-12 specification.
4. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-12 on page 2-49 for
connectivity. This resistor is not required during normal operation.
5. Output drive strength is below JEDEC specification.
6. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
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