3-4 Revision 13 Table 3-1 shows the Flash*Freeze pin location on the available packages. The Flash*Freeze pin locat" />
參數(shù)資料
型號： AGLE600V5-FG484I
廠商： Microsemi SoC
文件頁數(shù)： 33/166頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 600K 484-FBGA
標(biāo)準(zhǔn)包裝： 60
系列： IGLOOe
邏輯元件/單元數(shù)： 13824
RAM 位總計(jì)： 110592
輸入/輸出數(shù)： 270
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 484-BGA
供應(yīng)商設(shè)備封裝： 484-FPBGA（23x23）
Pin Descriptions and Packaging
3-4
Revision 13
Table 3-1 shows the Flash*Freeze pin location on the available packages. The Flash*Freeze pin location
is independent of device (except for a PQ208 package), allowing migration to larger or smaller IGLOO
devices while maintaining the same pin location on the board. Refer to the "Flash*Freeze Technology
and Low Power Modes" chapter of the IGLOOe FPGA Fabric User’s Guide for more information on I/O
states during Flash*Freeze mode.
JTAG Pins
Low power flash devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run
at any voltage from 1.5 V to 3.3 V (nominal). VCC must also be powered for the JTAG state machine to
operate, even if the device is in bypass mode; VJTAG alone is insufficient. Both VJTAG and VCC to the
part must be supplied to allow JTAG signals to transition the device. Isolating the JTAG power supply in a
separate I/O bank gives greater flexibility in supply selection and simplifies power supply and PCB
design. If the JTAG interface is neither used nor planned for use, the VJTAG pin together with the TRST
pin could be tied to GND.
TCK
Test Clock
Test clock input for JTAG boundary scan, ISP, and UJTAG. The TCK pin does not have an internal pull-
up/-down resistor. If JTAG is not used, Microsemi recommends tying off TCK to GND through a resistor
placed close to the FPGA pin. This prevents JTAG operation in case TMS enters an undesired state.
Note that to operate at all VJTAG voltages, 500
to 1 k will satisfy the requirements. Refer to Table 3-2
for more information.
Table 3-1 Flash*Freeze Pin Locations for IGLOOe Devices
Package
Flash*Freeze Pin
FG256
T3
FG484
W6
FG896
AH4
Table 3-2 Recommended Tie-Off Values for the TCK and TRST Pins
VJTAG
Tie-Off Resistance 1,2
VJTAG at 3.3 V
200
to 1 k
VJTAG at 2.5 V
200
to 1 k
VJTAG at 1.8 V
500
to 1 k
VJTAG at 1.5 V
500
to 1 k
Notes:
1. The TCK pin can be pulled-up or pulled-down.
2. The TRST pin is pulled-down.
3. Equivalent parallel resistance if more than one device is on the JTAG chain
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLE600V5-FG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FG896I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FGG256 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOOe 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
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