參數(shù)資料
型號(hào): AGLN030V2-ZFQNG68
元件分類: FPGA
英文描述: FPGA, PQCC68
封裝: 8 X 8 MM, 0.90 HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68
文件頁數(shù): 38/114頁
文件大?。?/td> 3991K
代理商: AGLN030V2-ZFQNG68
IGLOO nano Low-Power Flash FPGAs
Advance v0.4
III
IGLOO nano Ordering Information
Notes:
1. Marking Information: IGLOO nano V2 devices do not have V2 marking, but IGLOO nano V5 devices are marked with a V5
designator.
2. The DC and switching characteristics for the –F speed grade targets are based only on simulation. The characteristics provided for
the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions might be added and will be
reflected in future revisions of this document. The –F speed grade is only supported in the commercial temperature range.
3. For the AGLN060, AGLN125, and AGLN250, the Z feature grade does not support the enhanced nano features of Schmitt trigger
input, bus hold, cold-sparing, and hot-swap I/O capability. The AGLN030 Z feature grade does not support Schmitt trigger input
and bus hold. For the VQ100, CS81, UC81, QN68, and QN48 packages, the Z feature grade and the N part number are not marked
on the device.
AGLN010 = 10,000 System Gates
AGLN015 = 15,000 System Gates
AGLN020 = 20,000 System Gates
AGLN030 = 30,000 System Gates
AGLN060 = 60,000 System Gates
AGLN125 = 125,000 System Gates
AGLN250 = 250,000 System Gates
Speed Grade
Blank = Standard
F = 20% Slower than Standard
Feature Grade
Z = nano devices without enhanced features
Supply Voltage
2 = 1.2 V to 1.5 V
5 = 1.5 V only
AGLN250
V2
Z
VQ
_
Part Number
IGLOO nano Devices
Package Type
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
DIELOT = Known Good Die
QN = Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)
100
I
Package Lead Count
G
Lead-Free Packaging
Application (Temperature Range)
Blank = Commercial (
20°C to +70°C Ambient Temperature)
I= Industrial (
40°C to +85°C Ambient Temperature)
Blank = Standard Packaging
G= RoHS-Compliant Packaging
PP = Pre-Production
ES =Engineering Sample (Room Temperature Only)
CS = Chip Scale Package (0.5 mm pitch)
UC = Micro Chip Scale Package (0.4 mm pitch)
3
2
相關(guān)PDF資料
PDF描述
AGLN030V2-ZFUC81 FPGA, PBGA81
AGLN030V2-ZFUCG81 FPGA, PBGA81
AGLN030V2-ZFVQ100 FPGA, PQFP100
AGLN030V2-ZFVQG100 FPGA, PQFP100
AGLN250V2-FCS81 FPGA, PBGA81
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN030V2-ZQNG48 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN030V2-ZQNG68I 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN030V2-ZUCG81 功能描述:IC FPGA NANO 1KB 30K 81-UCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)