2-36 Revision 17 Timing Characteristics Applies to 1.5 V DC Core Voltage Applies to 1" />
參數資料
型號: AGLN030V5-ZQNG68
廠商: Microsemi SoC
文件頁數: 99/150頁
文件大小: 0K
描述: IC FPGA NANO 1KB 30K 68-QFN
標準包裝: 260
系列: IGLOO nano
邏輯元件/單元數: 768
輸入/輸出數: 49
門數: 30000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -20°C ~ 70°C
封裝/外殼: 68-VFQFN 裸露焊盤
供應商設備封裝: 68-QFN(8x8)
IGLOO nano DC and Switching Characteristics
2-36
Revision 17
Timing Characteristics
Applies to 1.5 V DC Core Voltage
Applies to 1.2 V DC Core Voltage
Table 2-53 1.8 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
0.97
5.44 0.19 1.03
1.44
0.66
5.25 5.44 1.69 1.35
ns
4 mA
STD
0.97
4.44 0.19 1.03
1.44
0.66
4.37 4.44 1.99 2.11
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-54 1.8 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
0.97
2.64 0.19 1.03
1.44
0.66
2.59 2.64 1.69 1.40
ns
4 mA
STD
0.97
2.08 0.19 1.03
1.44
0.66
2.12 1.95 1.99 2.19
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-55 1.8 V LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
1.55
5.92 0.26 1.13
1.59
1.10
5.72 5.92 2.11 1.95
ns
4 mA
STD
1.55
4.91 0.26 1.13
1.59
1.10
4.82 4.91 2.42 2.73
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-56 1.8 V LVCMOS High Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
1.55
3.05 0.26 1.13
1.59
1.10
3.01 3.05 2.10 2.00
ns
4 mA
STD
1.55
2.49 0.26 1.13
1.59
1.10
2.53 2.34 2.42 2.81
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
相關PDF資料
PDF描述
AMC28DRTH-S93 CONN EDGECARD 56POS DIP .100 SLD
AMC28DREN-S93 CONN EDGECARD 56POS .100 EYELET
AMC28DREH-S93 CONN EDGECARD 56POS .100 EYELET
RCB60DHAR-S793 CONN EDGECARD 120PS DIP .05 3.3V
A3P030-1QNG48 IC FPGA 1KB FLASH 30K 48-QFN
相關代理商/技術參數
參數描述
AGLN030V5-ZQNG68I 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN030V5-ZUCG81 功能描述:IC FPGA NANO 1KB 30K 81-UCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN030V5-ZUCG81I 功能描述:IC FPGA NANO 1KB 30K 81-UCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN030V5-ZVQ100 功能描述:IC FPGA NANO 1KB 30K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN030V5-ZVQ100I 功能描述:IC FPGA NANO 1KB 30K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)