參數(shù)資料
型號： AM29DL642G90MDI
廠商： ADVANCED MICRO DEVICES INC
元件分類： PROM
英文描述： 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only Simultaneous Read/Write Flash Memo
中文描述： 8M X 16 FLASH 3.3V PROM MODULE, 90 ns, PBGA63
封裝： 10.95 X 11.95 MM, 0.80 MM PITCH, FBGA-63
文件頁數(shù)： 5/54頁
文件大?。?/td> 828K
代理商： AM29DL642G90MDI
June 10, 2005
Am29DL642G
3
P R E L I M I N A R Y
TABLE OF CONTENTS
Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1
General Description . . . . . . . . . . . . . . . . . . . . . . . . 2
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29DL642G Device Bus Operations ................................9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ..............................9
Accelerated Program Operation .............................................10
Autoselect Functions ..............................................................10
Simultaneous Read/Write Operations with Zero Latency .......10
Standby Mode ........................................................................10
Automatic Sleep Mode ...........................................................10
RESET#: Hardware Reset Pin ...............................................10
Output Disable Mode ..............................................................11
Table 2. Am29DL642G Sector Architecture ....................................11
Table 4. Bank Address ....................................................................17
SecSi
TM
Sector Addresses............................................................. 17
Autoselect Mode .....................................................................17
Table 6. Am29DL642G Autoselect Codes, (High Voltage Method) 18
Sector/Sector Block Protection and Unprotection ..................19
Table 7. Am29DL642G Boot Sector/Sector Block
Addresses for Protection/Unprotection ...........................................19
Write Protect (WP#) ................................................................20
Table 8. WP#/ACC Modes ..............................................................20
Temporary Sector Unprotect ..................................................20
Figure 1. Temporary Sector Unprotect Operation........................... 20
Figure 2. In-System Sector Protect/Unprotect Algorithms.............. 21
SecSi (Secured Silicon) Sector
FlashMemoryRegion ............................................................22
Hardware Data Protection ......................................................22
Low VCC Write Inhibit ............................................................22
Write Pulse “Glitch” Protection ...............................................23
Logical Inhibit ..........................................................................23
Power-Up Write Inhibit ............................................................23
Common Flash Memory Interface (CFI) . . . . . . .23
Table 9. CFI Query Identification String.......................................... 23
System Interface String................................................................... 24
Table 11. Device Geometry Definition............................................ 24
Table 12. Primary Vendor-Specific Extended Query...................... 25
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 26
Reading Array Data ................................................................26
Reset Command .....................................................................26
Autoselect Command Sequence ............................................26
Enter SecSi Sector/Exit SecSi Sector
Command Sequence ..............................................................26
Word Program Command Sequence .....................................27
Unlock Bypass Command Sequence .....................................27
Figure 3. Program Operation.......................................................... 28
Chip Erase Command Sequence ...........................................28
Sector Erase Command Sequence ........................................28
Erase Suspend/Erase Resume Commands ...........................29
Figure 4. Erase Operation.............................................................. 29
Table 13. Am29DL642G Command Definitions.............................. 30
Write Operation Status . . . . . . . . . . . . . . . . . . . . 31
DQ7: Data# Polling .................................................................31
Figure 5. Data# Polling Algorithm.................................................. 31
RY/BY#: Ready/Busy# ............................................................32
DQ6: Toggle Bit I ....................................................................32
Figure 6. Toggle Bit Algorithm........................................................ 32
DQ2: Toggle Bit II ...................................................................33
Reading Toggle Bits DQ6/DQ2 ...............................................33
DQ5: Exceeded Timing Limits ................................................33
DQ3: Sector Erase Timer .......................................................33
Table 14. Write Operation Status ...................................................34
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 35
Figure 7. Maximum Negative OvershootWaveform...................... 35
Figure 8. Maximum Positive OvershootWaveform........................ 35
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 9. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 37
Figure 10. Typical I
CC1
vs. Frequency............................................ 37
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 11. Test Setup.................................................................... 38
Figure 12. Input Waveforms and Measurement Levels................. 38
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39
Read-Only Operations ...........................................................39
Figure 13. Read Operation Timings............................................... 39
Hardware Reset (RESET#) ....................................................40
Figure 14. Reset Timings............................................................... 40
Erase and Program Operations ..............................................41
Figure 15. Program Operation Timings.......................................... 42
Figure 16. Accelerated Program Timing Diagram.......................... 42
Figure 17. Chip/Sector Erase Operation Timings.......................... 43
Figure 18. Back-to-back Read/Write Cycle Timings...................... 44
Figure 19. Data# Polling Timings (During Embedded Algorithms). 44
Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 45
Figure 21. DQ2 vs. DQ6................................................................. 45
Temporary Sector Unprotect ..................................................46
Figure 22. Temporary Sector Unprotect Timing Diagram.............. 46
Figure 23. Sector/Sector Block Protect and
Unprotect Timing Diagram............................................................. 47
Alternate CE# Controlled Erase and Program Operations .....48
Figure 24. Alternate CE# Controlled Write (Erase/Program)
OperationTimings.......................................................................... 49
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51
FSD063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
10.95x11.95mmpackage ....................................................51
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52
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