參數(shù)資料
型號： AM49DL3208GB70FS
廠商： SPANSION LLC
元件分類： 存儲器
英文描述： SPECIALTY MEMORY CIRCUIT, PBGA69
封裝： 8 X 10 MM, FBGA-69
文件頁數(shù)： 55/61頁
文件大?。?/td> 904K
代理商： AM49DL3208GB70FS
March 12, 2004
Am49DL3208G
57
ADV ANCE
I N FO RMAT I O N
PHYSICAL DIMENSIONS
TLB069—69–Ball Fine-Pitch Grid Array 8 x 10 mm
E1
7
SE
A
D1
eD
DC
E
F
G
H
J
K
10
8
9
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
BOTTOM VIEW
C
0.08
0.20 C
A
E
B
C
0.15
(2X)
C
D
C
0.15
(2X)
INDEX MARK
10
6
b
TOP VIEW
SIDE VIEW
CORNER
69X
A1
A2
A
M
0.15
C
MC
AB
0.08
PIN A1
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7.
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = E/2
8.
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9.
NOT USED.
10. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
PACKAGE
TLB 069
JEDEC
N/A
10.00 mm X 8.00 mm PACKAGE
NOTE
SYMBOL
MIN.
NOM.
MAX.
A
---
1.20
PROFILE
A1
0.20
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
10.00 BSC
BODY SIZE
E
8.00 BSC
BODY SIZE
D1
7.20 BSC
MATRIX FOOTPRINT
E1
7.20 BSC
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
69
BALL COUNT
Ob
0.33
---
0.43
BALL DIAMETER
eE
0.80 BSC
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD/SE
0.40 BSC
SOLDER BALL PLACEMENT
A2,A3,A4,A7,A8,A9,B2,B9,B10
DEPOPULATED SOLDER BALLS
C1,C10,D1,D10,E5,E6,F5,F6
G1,G10,H1,H10
J1,J2,J9,J10,K2,K3,K4,K7,K8,K9
NOTES:
w052903-163814C
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