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AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
processor thermal margins, be a non-custom solution that is
readily available, be easy to attach to personal computer moth-
erboards, have adequate mechanical attachment to withstand
personal computer shock and vibration specifications, and be
cost effective.
Definition of Thermal Terms
This section defines the thermal-related terms used in this
document.
Temperature (T)
is the degree of hotness or coldness of a mate-
rial. The temperature abbreviation, T, is used in the following
terms:
I
T
junction
is the junction temperature of the processor die
T
case
is the temperature of the processor case
T
s
is the temperature of the heat sink
T
a
is the ambient temperature. Ambient temperature is the
average or mean temperature of the surrounding air that
comes in contact with the unit under test. For personal com-
puter applications, ambient temperature is the average
temperature inside the personal computer that comes in
contact with the heat sink and processor case.
I
I
I
Thermal Resistance (
θ
)
is the opposition offered by a medium
to the passage of thermal energy and is expressed in units of
o
C / watts. The thermal resistance abbreviation,
θ
, is used in
the following terms:
θ
jc
is the thermal resistance from junction to processor case
θ
cs
is the thermal resistance from case to heat sink
θ
sa
is the thermal resistance from heat sink to ambient air
I
I
I
Heat Transfer
is the process of thermal energy flowing from a
body of higher temperature to a body of lower temperature.
The means of transfer are conduction, convection, and radia-
tion.
Natural Convection
is the movement of ambient air over,
around, and through a heat sink that is induced by tempera-
ture differences generated as a byproduct of processor power