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參數(shù)資料
| 型號： | AMD-K6-III |
| 英文描述： | AMD-K6-III - AMD-K6-III Processor Data Sheet |
| 中文描述： | 的AMD - K6 -Ⅲ -的AMD - K6 - III處理器數(shù)據(jù)手冊 |
| 文件頁數(shù)： | 12/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K6-III |
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4
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
exceed its maximum operating temperature and fail. The junc-
tion temperature of the processor is a function of the thermal
resistance between the junction and the ambient air, the
amount of heat being dissipated, and the ambient air
temperature.
Heat Sink Equations
The total thermal resistance from junction to ambient air,
θ
ja
,
is equal to the sum of the following: thermal resistance from
junction to case, thermal resistance from case to heat sink, and
thermal resistance from heat sink to ambient air (see Equation
1 and Figure 1 for more information).
Equation 1
θ
ja
=
θ
jc
+
θ
cs
+
θ
sa
Figure 1. Series Resistance Representation of the Thermal Resistance Path
When the processor dissipates heat via the thermal interface
layer, the relationship of the temperatures at the different
thermal boundaries is found by using Equation 2:
Equation 2 P
max
= (T
j
- T
a
) / (
θ
jc
+
θ
cs
+
θ
sa
)
where
I
P
max
is the maximum power consumption (in watts) of the
AMD-K5 processor
T
j
is the operating junction temperature of the processor
die
T
a
is the average ambient temperature inside the personal
computer enclosure
I
I
相關PDF資料 |
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| AMD-K6-III-P | Mobile AMD-K6?-III-P Processor Data Sheet |
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| AMD-K6-III/400AFR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
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| AMD-K6-III+ | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Mobile AMD-K6?-III+ Processor Data Sheet |
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