參數(shù)資料
型號: AMD-K6-III
英文描述: AMD-K6-III - AMD-K6-III Processor Data Sheet
中文描述: 的AMD - K6 -Ⅲ -的AMD - K6 - III處理器數(shù)據(jù)手冊
文件頁數(shù): 15/44頁
文件大?。?/td> 2886K
代理商: AMD-K6-III
Heat Sinks
7
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
Figure 2. Natural and Forced Convection Curves for a Typical Heat Sink
Extruded Aluminum
Heat Sinks
The extruded aluminum heat sink is the least expensive pro-
cessor cooling solution, but it must be aligned with an airflow
or have an attached fan. Many of the least expensive heat sink/
fan modules use aluminum extruded heat sinks.
If the extruded aluminum heat sink is not used with an
attached fan module, the forced airflow must be generated by
the personal computer power supply fan or system fan. The
power supply fan usually blows warm air out of the system
enclosure. Personal computer airflow can be obstructed by any
of the following items: expansion cards, ribbon cables, internal
peripherals, power cables, and brackets. Extruded aluminum
heat sinks are specified usually with airflow entering the heat
sink from one of two open ends. Using the extruded aluminum
heat sink requires an in-depth knowledge of the airflow veloc-
ity and direction. To optimize heat sink efficiency, the airflow
should be aligned with the extruded length of the heat sink.
Extruded aluminum heat sinks for the AMD-K5 processor are
available with the following configuration variables: number
of fins, location and thickness of fins, fin heights, and thickness
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