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參數(shù)資料
| 型號： | AMD-K6-III |
| 英文描述： | AMD-K6-III - AMD-K6-III Processor Data Sheet |
| 中文描述： | 的AMD - K6 -Ⅲ -的AMD - K6 - III處理器數(shù)據(jù)手冊 |
| 文件頁數(shù)： | 13/44頁 |
| 文件大小： | 2886K |
| 代理商： | AMD-K6-III |
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Heat Sinks
5
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
I
θ
jc
is the thermal resistance from junction to case
θ
cs
is the thermal resistance from case to heat sink
θ
sa
is the thermal resistance from heat sink to ambient air
I
I
The above relationship can also be stated in the following
forms:
Equation 3 P
max
= (T
c
- T
a
) / (
θ
cs
+
θ
sa
)
Equation 4 P
max
= (T
s
- T
a
) / (
θ
sa
)
where
I
T
c
is the case temperature of the AMD-K5 processor
T
s
is the heat sink temperature
I
The heat sink selection process requires knowledge of the fol-
lowing system variables:
I
Available volume of space to be occupied without interfer-
ence of other system components (e.g., personal computer
expansion cards, side walls of enclosure, peripherals,
cables, etc.)
The maximum allowable device junction temperature of
the processor die
The maximum power dissipation of the processor
The device configuration (package size and orientation of
the package)
Ambient conditions (temperature, air velocity, and airflow
direction)
I
I
I
I
Types of Heat Sinks
The most frequently used heat sinks for processor cooling
applications are discussed in the following sections. These heat
sinks are designed to transfer heat from the processor into the
air inside a personal computer case. Several manufacturers
offer standard, cost effective, aluminum products (e.g.,
extruded, pin fin, die cast), composition products, and custom
products. Each heat sink should have the following items spec-
ified: thermal resistance (i.e., natural and forced air), size
(length, width, and height), and weight. Many heat sink prod-
uct families have one standard shape and varying heights
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMD-K6-III-P | Mobile AMD-K6?-III-P Processor Data Sheet |
| AMD-K7500MTR51BC | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BA | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BC | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7600MTR51BA | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMD-K6-III/400AFR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| AMD-K6-III/400AHX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| AMD-K6-III/450AFX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| AMD-K6-III/450AHX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| AMD-K6-III+ | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Mobile AMD-K6?-III+ Processor Data Sheet |
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