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參數(shù)資料
| 型號(hào)： | AMD-K7550MTR51BC |
| 元件分類： | 微處理器 |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| 中文描述： | 微處理器| 32位|的CMOS |卡|塑料 |
| 文件頁數(shù)： | 12/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K7550MTR51BC |
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4
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
exceed its maximum operating temperature and fail. The junc-
tion temperature of the processor is a function of the thermal
resistance between the junction and the ambient air, the
amount of heat being dissipated, and the ambient air
temperature.
Heat Sink Equations
The total thermal resistance from junction to ambient air,
θ
ja
,
is equal to the sum of the following: thermal resistance from
junction to case, thermal resistance from case to heat sink, and
thermal resistance from heat sink to ambient air (see Equation
1 and Figure 1 for more information).
Equation 1
θ
ja
=
θ
jc
+
θ
cs
+
θ
sa
Figure 1. Series Resistance Representation of the Thermal Resistance Path
When the processor dissipates heat via the thermal interface
layer, the relationship of the temperatures at the different
thermal boundaries is found by using Equation 2:
Equation 2 P
max
= (T
j
- T
a
) / (
θ
jc
+
θ
cs
+
θ
sa
)
where
I
P
max
is the maximum power consumption (in watts) of the
AMD-K5 processor
T
j
is the operating junction temperature of the processor
die
T
a
is the average ambient temperature inside the personal
computer enclosure
I
I
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