參數(shù)資料
型號(hào): AMD-K7550MTR51BC
元件分類: 微處理器
英文描述: MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC
中文描述: 微處理器| 32位|的CMOS |卡|塑料
文件頁數(shù): 16/44頁
文件大?。?/td> 2886K
代理商: AMD-K7550MTR51BC
8
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
of the base plate. For an example of an extruded aluminum
heat sink, see Figure 3A.
Figure 3. Extruded and Pin Fin Heat Sinks
The example in Figure 3A has a base plate and 15 fins. The
base plate would have a layer of thermal interface material
applied to it (e.g., thermal grease) and then be mounted
against the top of the AMD-K5 processor ceramic case top. The
dimensions of the heat sinks in Figure 3 are represented by x
and y for the base and h for the height.
Pin Fin Aluminum
Heat Sinks
The pin fin aluminum heat sink is cost effective (e.g., approxi-
mately 1.2 times the cost of the extruded aluminum heat sink)
and has the advantage of omnidirectional airflow. This means
that airflow can efficiently enter the heat sink from any side.
The airflow is maximized if it is in line with the row of pins. In
personal computer cases, airflow moves in many directions
because of mechanical restrictions.
Therefore, pin fin heat sinks
are generally recommended
. For an example of a pin fin heat
sink, see Figure 3B.
The pin fin aluminum heat sink can also be manufactured with
an attached fan module. If a fan is attached, the height of the
module is the combination of the heat sink height and the fan
height.
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