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| 型號(hào)： | AMD-K7550MTR51BC |
| 元件分類(lèi)： | 微處理器 |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| 中文描述： | 微處理器| 32位|的CMOS |卡|塑料 |
| 文件頁(yè)數(shù)： | 27/44頁(yè) |
| 文件大小： | 2886K |
| 代理商： | AMD-K7550MTR51BC |
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Physical Dimensions of the AMD-K5 Processor
19
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
Both the ceramic and the ceramic thermal slug PGA packages
have the same overall dimensions (see Figure 7A and Figure
7B). Thus, the same cooling solution can be used for both pro-
cessor packages. The heat sink clip that mechanically attaches
the heat sink and processor to the processor ZIF socket is not
affected by the package. The thermal interface layer (i.e., the
silicon grease) has a cross sectional area of 3.8 square inches
(1.95 inch squared) for the ceramic package, and 1.56 square
inches (1.25 inch squared) for the ceramic thermal slug pack-
age. The copper slug has greater thermal conductivity than
the ceramic package, allowing the processor junction to oper-
ate at a lower temperature for the same power levels. Vibra-
tion and shock testing have shown that the same heat sink clips
perform equally for both processor packages.
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