參數(shù)資料
型號： AMD29DL163DB70PCI
元件分類： EEPROM
英文描述： EEPROM
中文描述： EEPROM的
文件頁數(shù)： 3/53頁
文件大?。?/td> 1167K
代理商： AMD29DL163DB70PCI
July 29, 2002
Am29DL16xD
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5
Special Package Handling Instructions ..........................................6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29DL16xD Device Bus Operations ......................................9
Word/Byte Configuration ................................................................9
Requirements for Reading Array Data ...........................................9
Writing Commands/Command Sequences ..................................10
Accelerated Program Operation ...............................................10
Autoselect Functions .................................................................10
Simultaneous Read/Write Operations with Zero Latency ............10
Standby Mode ..............................................................................10
Automatic Sleep Mode .................................................................10
RESET#: Hardware Reset Pin .....................................................11
Output Disable Mode ...................................................................11
Table 2. Am29DL16xD Device Bank Divisions .....................................11
Table 3. Sector Addresses for Top Boot Sector Devices ......................12
Table 4. SecSi
Sector Addresses for Top Boot Devices.................. 12
Table 5. Sector Addresses for Bottom Boot Sector Devices .................13
Table 6. SecSi
Addresses for Bottom Boot Devices........................ 13
Autoselect Mode ..........................................................................14
Table 7. Am29DL16xD Autoselect Codes, (High VoltageMethod) ......14
Sector/Sector Block Protection and Unprotection ........................15
Table 8. Top Boot Sector/Sector Block Addresses
forProtection/Unprotection ...................................................................15
Table 9. Bottom Boot Sector/Sector Block Addresses
forProtection/Unprotection ...................................................................15
Write Protect (WP#) .....................................................................16
Temporary Sector/Sector Block Unprotect ...................................16
Figure 1. Temporary Sector Unprotect Operation................................. 16
Figure 2. In-System Sector/Sector Block Protection and
UnprotectionAlgorithms........................................................................ 17
SecSi
(Secured Silicon) Sector Flash MemoryRegion ............18
Factory Locked: SecSi Sector Programmed and ProtectedAt the
Factory ......................................................................................18
Customer Lockable: SecSi Sector NOT Programmed or
ProtectedAt the Factory ...........................................................18
Hardware Data Protection ............................................................18
Low VCC Write Inhibit ...............................................................19
Write Pulse “Glitch” Protection ..................................................19
Logical Inhibit ............................................................................19
Power-Up Write Inhibit ..............................................................19
Common Flash Memory Interface (CFI) . . . . . . . 19
Table 10. CFI Query Identification String.............................................. 19
Table 11. System Interface String......................................................... 20
Table 12. Device Geometry Definition.................................................. 20
Table 13. Primary Vendor-Specific Extended Query............................ 21
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 22
Reading Array Data ......................................................................22
Reset Command ..........................................................................22
Autoselect Command Sequence ..................................................22
Enter SecSi
Sector/Exit SecSi Sector Command Sequence ....23
Byte/Word Program Command Sequence ...................................23
Unlock Bypass Command Sequence .......................................23
Figure 3. Program Operation................................................................ 24
Chip Erase Command Sequence .................................................24
Sector Erase Command Sequence ..............................................24
Erase Suspend/Erase Resume Commands ................................25
Figure 4. Erase Operation.................................................................... 25
Command Definitions ...................................................................26
Table 14. Am29DL16xD Command Definitions ....................................26
Write Operation Status . . . . . . . . . . . . . . . . . . . . 27
DQ7: Data# Polling ......................................................................27
Figure 5. Data# Polling Algorithm......................................................... 27
RY/BY#: Ready/Busy# .................................................................28
DQ6: Toggle Bit I ..........................................................................28
Figure 6. Toggle Bit Algorithm.............................................................. 28
DQ2: Toggle Bit II .........................................................................29
Reading Toggle Bits DQ6/DQ2 ....................................................29
DQ5: Exceeded Timng Limits ......................................................29
DQ3: Sector Erase Timer .............................................................29
Table 15. Write Operation Status .........................................................30
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 31
Figure 7. Maximum Negative OvershootWaveform............................. 31
Figure 8. Maximum Positive OvershootWaveform............................. 31
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 31
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 9. I
CC1
Current vs. Time (Showing Active and Automatic
SleepCurrents)..................................................................................... 33
Figure 10. Typical I
vs. Frequency................................................... 33
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 11. Test Setup.......................................................................... 34
Table 16. Test Specifications ................................................................34
Key To Switching Waveforms ......................................................34
Figure 12. Input Waveforms and Measurement Levels........................ 34
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 13. Read Operation Timings...................................................... 35
Figure 14. Reset Timings...................................................................... 36
Word/Byte Configuration (BYTE#) ...............................................37
Figure 15. BYTE# Timings for Read Operations.................................. 37
Figure 16. BYTE# Timings for Write Operations.................................. 37
Erase and Program Operations ...................................................38
Figure 17. Program Operation Timings................................................ 39
Figure 18. Accelerated Program Timing Diagram................................ 39
Figure 19. Chip/Sector Erase Operation Timings................................. 40
Figure 20. Back-to-back Read/Write Cycle Timings............................. 41
Figure 21. Data# Polling Timings (During Embedded Algorithms)....... 41
Figure 22. Toggle Bit Timings (During Embedded Algorithms)............ 42
Figure 23. DQ2 vs. DQ6....................................................................... 42
Temporary Sector/Sector Block Unprotect ...................................43
Figure 24. Temporary Sector/Sector Block Unprotect Timing Diagram 43
Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 44
Alternate CE# Controlled Erase and Program Operations ...........45
Figure 26. Alternate CE# Controlled Write (Erase/Program)
OperationTimings................................................................................ 46
Erase And Programming Performance . . . . . . . 47
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 47
Package and Pin Capacitance. . . . . . . . . . . . . . . 47
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
FBC048—48-Ball Fine-Pitch Ball Grid Array
8 x 9 mm package ........................................................................48
LAA064—64-Ball Fortified Ball Grid Array,
13 x 11 mm package ....................................................................49
TS 048—48-Pin Standard TSOP .................................................50
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 51
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AMD29DL163DB90WCI 制造商:未知廠家 制造商全稱:未知廠家 功能描述:EEPROM
AMD29DL163DT120EI 制造商:未知廠家 制造商全稱:未知廠家 功能描述:EEPROM
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