參數(shù)資料
型號(hào): AT24C08SC-09BT
廠商: ATMEL CORP
元件分類: PROM
英文描述: 1K X 8 I2C/2-WIRE SERIAL EEPROM, XMA8
封裝: SMART CARD MODULE-8
文件頁(yè)數(shù): 5/14頁(yè)
文件大?。?/td> 272K
代理商: AT24C08SC-09BT
AT24C01ASC/02SC/04SC/08SC/16SC
13
Smart Card Modules
M2 - A Module
- Ordering Code: 09AT
Module Size: M2
Dimension
(1): 12.6 x 11.4 mm
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M2 - B Module - Ordering Code: 09BT
Module Size: M2
Dimension
(1): 12.6 x 11.4 mm
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M4 - C Module - Ordering Code: 09CT
Module Size: M4
Dimension
(1): 12.6 x 12.6 mm
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm
Pitch: 14.25 mm
M4 - D Module - Ordering Code: 09DT
Module Size: M4
Dimension
(1): 12.6 x 12.6 mm
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M2 - E Module - Ordering Code: 09ET
Module Size: M2
Dimension
(1): 12.6 x 11.4 mm
Glob Top: Clear, Round: 7.5 mm max.
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M2 - F Module - Ordering Code: 09FT
Module Size: M2
Dimension
(1): 12.6 x 11.4 mm
Glob Top: Clear, Round: 8.0 mm max.
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M3 - G Module - Ordering Code: 09GT
Module Size: M3
Dimension
(1): 10.6 x 8.0 mm
Glob Top: Clear, Round: 6.5 mm max.
Thickness: 0.58 mm max.
Pitch: 9.5 mm
M3 - H Module - Ordering Code: 09HT
Module Size: M3
Dimension
(1): 10.6 x 8.0 mm
Glob Top: Clear, Round: 6.5 mm max.
Thickness: 0.58 mm max.
Pitch: 9.5 mm
Note:
1.
The module dimensions listed refer to the dimensions of the
exposed metal contact area. The actual dimensions of the
module after excise or punching from the carrier tape are
generally 0.4 mm greater in both directions (i.e. a punched
M2 module will yield 13.0 x 11.8 mm).
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參數(shù)描述
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