參數(shù)資料
型號(hào): ATTINY13A-SSHR
廠商: Atmel
文件頁數(shù): 14/67頁
文件大?。?/td> 0K
描述: MCU AVR 1KB FLASH 20MHZ 8SOIC
產(chǎn)品培訓(xùn)模塊: MCU Product Line Introduction
tinyAVR Introduction
標(biāo)準(zhǔn)包裝: 1
系列: AVR® ATtiny
核心處理器: AVR
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 6
程序存儲(chǔ)器容量: 1KB(512 x 16)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 64 x 8
RAM 容量: 64 x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: ATTINY13A-SSHRDKR
PIC16F72
DS39597C-page 118
2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
.100 BSC
Top to Seating Plane
A
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.050
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
e
b
b1
A1
A
3
Microchip Technology Drawing C04-070B
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ATTINY13A-SHR MCU AVR 1KB FLASH 20MHZ 8SOIC
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ATTINY13A-SSUR SL903 制造商:Atmel Corporation 功能描述:AVR, 1KB FLASH, 64B EE, 64B SRAM - 20 MHZ, JEDEC SOIC, IND T - Tape and Reel
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ATTINY13A-SU/LFCTC3136-01038 制造商:Atmel Corporation 功能描述:MCU 8BIT ATTINY RISC 1KB FLASH 2.5V/3.3V/5V 8SOIC EIAJ - Rail/Tube