參數(shù)資料
型號: AUIRFS3006-7TRL
元件分類: JFETs
英文描述: 240 A, 60 V, 0.0021 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263CB
封裝: ROHS COMPLIANT, PLASTIC, D2PAK-7
文件頁數(shù): 1/11頁
文件大?。?/td> 239K
代理商: AUIRFS3006-7TRL
08/22/11
www.irf.com
1
HEXFET Power MOSFET
S
D
G
PD - 97714
AUIRFS3006-7P
VDSS
60V
RDS(on) typ.
1.5m
:
max.
2.1m
:
ID (Silicon Limited)
293A
c
ID (Package Limited)
240A
AUTOMOTIVE GRADE
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
GD
S
Gate
Drain
Source
D2Pak 7 Pin
G
S
D
S
Description
Specifically designed for Automotive applications, this HEXFET
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design
are a 175°C junction operating
temperature, fast switching speed and improved repetitive
avalanche rating . These features combine to make this design
an extremely efficient and reliable device for use in Automotive
applications and a wide variety of other applications.
Features
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
HEXFET is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
Symbol
Parameter
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Package Limited)
IDM
Pulsed Drain Current d
PD @TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
VGS
Gate-to-Source Voltage
V
EAS
Single Pulse Avalanche Energy (Thermally Limited) e
mJ
IAR
Avalanche Current
d
A
EAR
Repetitive Avalanche Energy
d
mJ
dv/dt
Peak Diode Recovery f
V/ns
TJ
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Thermal Resistance
Symbol
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case kl
–––
0.4
RθJA
Junction-to-Ambient (PCB Mount) j
–––
40
°C
A
°C/W
300
375
11
Max.
293
c
207c
1172
240
-55 to + 175
± 20
2.5
303
See Fig. 14, 15, 22a, 22b,
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