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參數(shù)資料
| 型號： | BQ25070DQCR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 1 A BATTERY CHARGE CONTROLLER, PDSO10 |
| 封裝： | 2 X 3 MM, GREEN, PLASTIC, SON-10 |
| 文件頁數(shù)： | 12/21頁 |
| 文件大小： | 664K |
| 代理商： | BQ25070DQCR |
SLUSA66
– JULY 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
PART NUMBER
ILIM(DEF)
VBAT(OVCH)
VBAT(FLOAT)
VOVP
VLDO
MARKING
bq25070DQCR
300 mA
3.7 V
3.5 V
10.5 V
4.9 V
QUS
bq25070DQCT
300 mA
3.7 V
3.5 V
10.5 V
4.9 V
QUS
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com (www.ti.com),
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
IN (with respect to GND)
–0.3 to 30
V
Input Voltage
CTRL, TS (with respect to GND)
–0.3 to 7
V
Output Voltage
BAT, OUT, LDO, CHG, IMON (with respect to GND)
–0.3 to 7
V
Input Current (Continuous)
IN
1.2
A
Output Current (Continuous)
BAT
1.2
A
Output Current (Continuous)
LDO
100
mA
Output Sink Current
CHG
5
mA
Junction temperature, TJ
–40 to 150
°C
Storage temperature, TSTG
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
THERMAL INFORMATION
bq25070
THERMAL METRIC(1)
SON
UNITS
10 PINS
θJA
Junction-to-ambient thermal resistance(2)
58.7
°C/W
θJCtop
Junction-to-case (top) thermal resistance(3)
3.9
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNITS
IN voltage range
3.75(1)
28
VIN
V
IN operating voltage range
3.75(1)
10.2
IIN
Input current, IN
1
A
IOUT
Output Current in charge mode, OUT
1
A
TJ
Junction Temperature
0
125
°C
(1)
Charge current may be limited at low input voltages due to the dropout of the device.
2
Copyright
2011, Texas Instruments Incorporated
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