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參數(shù)資料
| 型號： | BQ25070DQCR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 1 A BATTERY CHARGE CONTROLLER, PDSO10 |
| 封裝： | 2 X 3 MM, GREEN, PLASTIC, SON-10 |
| 文件頁數(shù)： | 20/21頁 |
| 文件大小： | 664K |
| 代理商： | BQ25070DQCR |
BAT
CHG
OUT
IN
IMON
GND
TS
10 -pin 2mmx 3mmDFN
bq25070
3
4
5
2
1
8
7
6
9
10
CTRL
LDO
GND
(TopView)
SLUSA66
– JULY 2011
PIN CONFIGURATION
PIN FUNCTIONS
PIN
I/O
DESCRIPTION
NAME
NO.
IN
1
I
Input power supply. IN is connected to the external DC supply (AC adapter or USB port). Bypass IN to GND
with at least a 0.1
μF ceramic capacitor.
IMON
2
O
Current monitoring output. Connect a 1k
Ω resistor from IMON to GND to monitor the input current. The
voltage at IMON ranges from 0V to 1V which corresponds to an input current from 0A to 1A.
GND
3, 9
–
Ground terminal. Connect to the thermal pad and the ground plane of the circuit.
LDO
4
O
LDO output. LDO is regulated to 4.9V and drives up to 50mA. Bypass LDO to GND with a 0.1
μF ceramic
capacitor. LDO is enabled when VUVLO < VIN < VOVP.
TS
5
I
Battery pack NTC monitoring input. Connect a resistor divider from LDO to GND with TS connected to the
center tap to set the charge temperature window. The battery pack NTC is connected in parallel with the
bottom resistor of the divider. See the Applications Design section for details on the selecting the proper
component values.
BAT
6
O
Battery connection output. BAT is the sense input for the battery. Connect BAT and OUT to the battery and
bypass to GND with a 1
μF ceramic capacitor.
CTRL
7
I
Single-input interface Input. Drive CTRL with pulses to enable/disable the device, enable/disable VIN-DPM,
and select current limits. See the interface section for details on using the CTRL interface.
CHG
8
O
Charge status indicator open-drain output. CHG is pulled low while the device is charging the battery. CHG
goes high impedance when the battery is fully charged.
OUT
10
O
System output connection. Connect OUT and BAT together. Bypass the OUT and BAT connection to GND
with a 1
μF ceramic capacitor.
Thermal
Pad
–
There is an internal electrical connection between the exposed thermal pad and the GND pin of the device.
PAD
The thermal pad must be connected to the same potential as the GND pin on the printed circuit board. Do not
use the thermal pad as the primary ground input for the device. GND pin must be connected to ground at all
times.
8
Copyright
2011, Texas Instruments Incorporated
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