參數(shù)資料
型號(hào): CY7C1170V18
廠商: Cypress Semiconductor Corp.
英文描述: 18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)
中文描述: 18兆位的DDR - II SRAM的2字突發(fā)架構(gòu)(2.5周期讀寫(xiě)延遲)
文件頁(yè)數(shù): 16/27頁(yè)
文件大?。?/td> 963K
代理商: CY7C1170V18
CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Document Number: 001-06620 Rev. *C
Page 23 of 27
Switching Waveform
Read/Write/Deselect Sequence
Figure 7. Waveform for 2.5 Cycle Read Latency[27, 28]
1
2
3
4
5
6
7
89
10
READ
NOP
WRITE
t
NOP
11
LD
R/W
A
tKH tKL
tCYC
tHC
tSA tHA
DON’T CARE
UNDEFINED
SC
A0
A1
A2
A3
A4
CQ
K
QVLD
t
NOP
DQ
K
tCCQO
tCQOH
tCCQO
tCQOH
QVLD
t
QVLD
t
QVLD
t
KHKH
12
READ
(Read Latency = 2.5 Cycles)
NOP
tCLZ
tCHZ
CQDOH
Q00
Q11
Q01 Q10
tDOH
tCO
Q40
tSD
HD
tSD
tHD
D20 D21
D30
D31
t
tCQD
t
tCQH
tCQHCQH
Notes
27. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0 + 1.
28. Outputs are disabled (High-Z) one clock cycle after a NOP.
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CY7C1170V18-400BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18M DDRII+, B2, 2.5 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1170V18-400BZXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18M DDRII+, B2, 2.5 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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CY7C1214F-100AC 制造商:Cypress Semiconductor 功能描述:
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