參數(shù)資料
型號(hào): CY7C1170V18
廠商: Cypress Semiconductor Corp.
英文描述: 18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)
中文描述: 18兆位的DDR - II SRAM的2字突發(fā)架構(gòu)(2.5周期讀寫延遲)
文件頁數(shù): 6/27頁
文件大?。?/td> 963K
代理商: CY7C1170V18
CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Document Number: 001-06620 Rev. *C
Page 14 of 27
TAP Controller State Diagram
Figure 2 shows the tap controller state diagram. [9]
Figure 2. Tap Controller State Diagram
TEST-LOGIC
RESET
TEST-LOGIC/
IDLE
SELECT
DR-SCAN
CAPTURE-DR
SHIFT-DR
EXIT1-DR
PAUSE-DR
EXIT2-DR
UPDATE-DR
SELECT
IR-SCAN
CAPTURE-IR
SHIFT-IR
EXIT1-IR
PAUSE-IR
EXIT2-IR
UPDATE-IR
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
Note
9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
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CY7C1177V18 18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1215H-100AXC 1-Mbit (32K x 32) Pipelined Sync SRAM
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參數(shù)描述
CY7C1170V18-400BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18M DDRII+, B2, 2.5 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1170V18-400BZXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18M DDRII+, B2, 2.5 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1170XC 制造商:Cypress Semiconductor 功能描述:
CY7C1214F-100AC 制造商:Cypress Semiconductor 功能描述:
CY7C1214F-100ACT 制造商:Cypress Semiconductor 功能描述: