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參數(shù)資料
| 型號(hào)： | D1022 |
| 廠商： | TT electronics Semelab Limited |
| 英文描述： | METAL GATE RF SILICON FET |
| 中文描述： | 金屬門(mén)射頻硅場(chǎng)效應(yīng)管 |
| 文件頁(yè)數(shù)： | 2/4頁(yè) |
| 文件大小： | 54K |
| 代理商： | D1022 |
D1022UK
Prelim.11/00
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
http://www.semelab.co.ukParameter
Test Conditions
PER SIDE
Min.
Typ.
Max.
Unit
70
3
1
7
1
2.4
0.1
10
50
20:1
180
90
7.5
V
GS
= 0
I
D
= 100mA
V
DS
= 28V
V
GS
= 0
V
GS
= 20V
I
D
= 10mA
V
DS
= 10V
V
DS
= 0
V
DS
= V
GS
I
D
= 3A
I
D
= 10mA
V
DS
= V
GS
P
O
= 100W
V
DS
= 28V
f = 500MHz
I
DQ
= 1.2A
V
DS
= 28V
V
DS
= 28V
V
DS
= 28V
V
GS
=
–
5V f = 1MHz
V
GS
= 0
V
GS
= 0
f = 1MHz
f = 1MHz
V
mA
m
A
V
mhos
V
dB
%
—
pF
pF
pF
ELECTRICAL CHARACTERISTICS
(T
case
= 25
°
C unless otherwise stated)
Drain
–
Source Breakdown
Voltage
Zero Gate Voltage
Drain Current
Gate Leakage Current
Gate Threshold Voltage*
Forward Transconductance*
Gate Threshold Voltage
Matching Between Sides
Common Source Power Gain
Drain Efficiency
Load Mismatch Tolerance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between leads and metal flange is beryllium oxide. Beryllium oxide dust is highly
toxic and care must be taken during handling and mounting to avoid damage to this area.
THESE DEVICES MUST NEVER BE THROWN AWAY WITH GENERAL INDUSTRIAL OR DOMESTIC WASTE.
R
THj
–
case
Thermal Resistance Junction
–
Case
Max. 0.6
°
C / W
THERMAL DATA
* Pulse Test:
Pulse Duration = 300
m
s , Duty Cycle
￡
2%
TOTAL DEVICE
PER SIDE
BV
DSS
I
DSS
I
GSS
V
GS(th)
g
fs
V
GS(th)match
G
PS
h
VSWR
C
iss
C
oss
C
rss
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