參數(shù)資料
型號(hào)： D640G12VE
廠商： Spansion Inc.
英文描述： 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory
中文描述： 64兆位（8米× 8位/ 4米x 16位），3.0伏的CMOS只，同步讀/寫閃存
文件頁(yè)數(shù)： 5/56頁(yè)
文件大小： 742K
代理商： D640G12VE
June 6, 2005
Am29DL640G
3
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7
Special Handling Instructions for BGA Packages .....................7
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10
Table 1. Am29DL640G Device Bus Operations ..............................10
Word/Byte Configuration........................................................ 10
Requirements for Reading Array Data ...................................10
Writing Commands/Command Sequences ............................11
Accelerated ProgramOperation .............................................11
Autoselect Functions ..............................................................11
Simultaneous Read/Write Operations with Zero Latency .......11
Standby Mode........................................................................ 11
Automatic Sleep Mode ...........................................................12
RESET#: Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................12
Table 2. Am29DL640G Sector Architecture ....................................12
Table 3. Bank Address ....................................................................15
Table 4. SecSi
TM
Sector Addresses................................................15
Autoselect Mode..................................................................... 15
Table 5. Am29DL640G Autoselect Codes, (High Voltage Method) 16
Sector/Sector Block Protection and Unprotection.................. 17
Table 6. Am29DL640G Boot Sector/Sector Block Addresses for
Protection/Unprotection ...................................................................17
Write Protect (WP#) ................................................................17
Table 7. WP#/ACC Modes ..............................................................18
Temporary Sector Unprotect ..................................................18
Figure 1. Temporary Sector Unprotect Operation........................... 18
Figure 2. In-SystemSector Protect/Unprotect Algorithms.............. 19
SecSi (Secured Silicon) Sector
FlashMemoryRegion ............................................................20
Figure 3. SecSi Sector Protect Verify.............................................. 21
Hardware Data Protection ......................................................21
Low VCC Write Inhibit ............................................................21
Write Pulse “Glitch” Protection ...............................................21
Logical Inhibit ..........................................................................21
Power-Up Write Inhibit ............................................................21
Common Flash Memory Interface (CFI). . . . . . . 21
Table 8. CFI Query Identification String.......................................... 22
Table 9. SystemInterface String......................................................22
Table 10. Device Geometry Definition............................................ 23
Table 11. Primary Vendor-Specific Extended Query...................... 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . 25
Reading Array Data ................................................................25
Reset Command .....................................................................25
Autoselect Command Sequence ............................................25
Enter SecSi Sector/Exit SecSi Sector
Command Sequence ..............................................................25
Byte/Word ProgramCommand Sequence .............................26
Unlock Bypass Command Sequence .....................................26
Figure 4. ProgramOperation.......................................................... 27
Chip Erase Command Sequence ...........................................27
Sector Erase Command Sequence ........................................27
Figure 5. Erase Operation............................................................... 28
Erase Suspend/Erase Resume Commands ...........................28
Table 12. Am29DL640G Command Definitions............................. 29
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 30
DQ7: Data#Polling .................................................................30
Figure 6. Data#Polling Algorithm.................................................. 30
RY/BY#: Ready/Busy#............................................................ 31
DQ6: Toggle Bit I ....................................................................31
Figure 7. Toggle Bit Algorithm........................................................ 31
DQ2: Toggle Bit II ...................................................................32
Reading Toggle Bits DQ6/DQ2 ...............................................32
DQ5: Exceeded Timng Limts ................................................32
DQ3: Sector Erase Timer .......................................................32
Table 13. Write Operation Status ...................................................33
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 34
Figure 8. MaximumNegative OvershootWaveform...................... 34
Figure 9. MaximumPositive OvershootWaveform........................ 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 10. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 36
Figure 11. Typical I
vs. Frequency............................................ 36
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 12. Test Setup.................................................................... 37
Figure 13. Input Waveforms and Measurement Levels................. 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Read-Only Operations ...........................................................38
Figure 14. Read Operation Timngs............................................... 38
Hardware Reset (RESET#) ....................................................39
Figure 15. Reset Timngs............................................................... 39
Word/Byte Configuration (BYTE#) ..........................................40
Figure 16. BYTE#Timngs for Read Operations............................ 40
Figure 17. BYTE#Timngs for Write Operations............................ 40
Erase and ProgramOperations ..............................................41
Figure 18. ProgramOperation Timngs.......................................... 42
Figure 19. Accelerated ProgramTimng Diagram.......................... 42
Figure 20. Chip/Sector Erase Operation Timngs.......................... 43
Figure 21. Back-to-back Read/Write Cycle Timngs...................... 44
Figure 22. Data# Polling Timngs (During Embedded Algorithms). 44
Figure 23. Toggle Bit Timngs (During Embedded Algorithms)...... 45
Figure 24. DQ2 vs. DQ6................................................................. 45
Temporary Sector Unprotect ..................................................46
Figure 25. Temporary Sector Unprotect Timng Diagram.............. 46
Figure 26. Sector/Sector Block Protect and
Unprotect Timng Diagram............................................................. 47
Alternate CE#Controlled Erase and ProgramOperations .....48
Figure 27. Alternate CE#Controlled Write (Erase/Program)
OperationTimngs.......................................................................... 49
Erase And Programming Performance. . . . . . . . 50
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 50
TSOP & BGA Pin Capacitance. . . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 52
FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
12x11mmpackage ..............................................................52
LAA064—64-Ball Fortified Ball Grid Array (
F
BGA)
13x11mmpackage ..............................................................53
TS 048—48-Pin Standard TSOP ............................................54
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
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