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參數(shù)資料
| 型號： | DAC667 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Microprocessor-Compatible 12-Bit Dightal-To-Analog Converter(與微處理器兼容的12位D/A轉(zhuǎn)換器) |
| 中文描述： | 微處理器兼容的12位Dightal到模擬轉(zhuǎn)換器（與微處理器兼容的12位的D / A轉(zhuǎn)換器） |
| 文件頁數(shù)： | 6/9頁 |
| 文件大?。?/td> | 218K |
| 代理商： | DAC667 |
DAC667
6
high speed performance. It is recommended that both power
ground (pin 16) and analog ground (AGND, pin 5) be
connected directly to a ground plane under the package. If a
ground plane is not used, connect the AGND and power
ground pins together close to the package. Since the refer-
ence point for V
OUT
and V
REF OUT
is the AGND pin, it is also
important to connect the load directly to the AGND pin.
The change in current in the AGND pin due to an input data
word change from 000
HEX
to FFF
HEX
is only 1mA.
OUTPUT VOLTAGE SWING
AND RANGE CONNECTIONS
The DAC667 output amplifier can provide
±
10V output
swing while operating on
±
11.4V supplies. The Analog
Devices AD667 requires a minimum of
±
12.5V to achieve
an output swing of
±
10V.
Internal scaling resistors provided in the DAC667 may be
connected to produce bipolar output voltage ranges of
±
10V,
±
5V or
±
2.5V or unipolar output voltage ranges of 0 to +5V
or 0 to +10V. Refer to Figures 6, 7 and 8. Connections for
various output ranges are shown in Table III.
The internal feedback resistors (5k
) and the bipolar offset
resistor (9.95k
) are trimmed to an absolute tolerance of
about
±
10%.
full scale (–10V) for an output transition from +10V to
–10V. Figure 4d shows the major carry glitch response for
input code transitions 7FF
HEX
to 800
HEX
and for 800
HEX
to
7FF
HEX
.
Unlike the Analog Devices AD667, the Burr-Brown DAC667
does not require an external capacitor (C
f
= 20pF) across
R
SPAN
to eliminate overshoot. Using the 20pF with the Burr-
Brown DAC667 increases the settling time about one micro-
second. The DAC667 settling time is specified at 7
μ
s maxi-
mum. The AD667 is specified at 4
μ
s maximum.
INSTALLATION
POWER SUPPLY CONNECTIONS
Note that the metal lid of the ceramic-packaged DAC667 is
connected to –V
EE
. Take care to avoid accidental short
circuits in tightly spaced installations.
Power supply decoupling capacitors should be added as
shown in Figure 5. Best settling performance occurs using a
1
μ
F to 10
μ
F tantalum capacitor at –V
EE
. Applications with
less critical settling time may be able to use 0.01
μ
F at –V
EE
as well as at +V
CC
. The capacitors should be located close to
the DAC667 package.
DAC667 features separate digital and analog power supply
returns to permit optimum connections for low noise and
(a) ± FULL SCALE OUTPUT SWING
2μs/Division
V
(
O
Data
= 000
HEX
Data = FFF
HEX
Data
= 000
HEX
20
15
10
5
0
–5
–10
–15
–20
5
0
C
C
f
= 0
CS
V
OUT
(b) PLUS FULL SCALE SETTLING, –10V TO +10V
1μs/Division
4
2
0
1
C
V
O
C
f
= 0
(d) MAJOR CARRY GLITCH
2μs/Division
V
O
250
200
150
100
50
0
+10
0
W
Data =
7FF
H
Data = 800
H
Data = 7FF
H
(c) MINUS FULL SCALE SETTLING, +10V TO –10V
1μs/Division
1
4
2
0
C
V
OUT
CS
V
O
C
f
= 0
FIGURE 4. Settling Time Performance, Z
LOAD
= 2k
|| 500pF.
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