參數(shù)資料
型號(hào): DS21552GN
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 77/137頁(yè)
文件大?。?/td> 0K
描述: IC TXRX T1 1-CHIP 5V 100-BGA
標(biāo)準(zhǔn)包裝: 1
功能: 單芯片收發(fā)器
接口: E1,HDLC,J1,T1
電路數(shù): 1
電源電壓: 4.75 V ~ 5.25 V
電流 - 電源: 75mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-LFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 100-CSBGA(10x10)
包裝: 托盤
包括: DSX-1 和 CSU 線路補(bǔ)償發(fā)生器,HDLC 控制器,帶內(nèi)回路代碼發(fā)生器和檢測(cè)器
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DS21352/DS21552
44 of 137
RIR1: RECEIVE INFORMATION REGISTER 1 (Address=22 Hex)
(MSB)
(LSB)
COFA
8ZD
16ZD
RESF
RESE
SEFE
B8ZS
FBE
SYMBOL
POSITION
NAME AND DESCRIPTION
COFA
RIR1.7
Change of Frame Alignment. Set when the last resync resulted in a change of frame
or multiframe alignment.
8ZD
RIR1.6
Eight Zero Detect. Set when a string of at least eight consecutive zeros (regardless of
the length of the string) have been received at RPOSI and RNEGI.
16ZD
RIR1.5
Sixteen Zero Detect. Set when a string of at least sixteen consecutive zeros (regardless
of the length of the string) have been received at RPOSI and RNEGI.
RESF
RIR1.4
Receive Elastic Store Full. Set when the receive elastic store buffer fills and a frame
is deleted.
RESE
RIR1.3
Receive Elastic Store Empty. Set when the receive elastic store buffer empties and a
frame is repeated.
SEFE
RIR1.2
Severely Errored Framing Event. Set when 2 out of 6 framing bits (Ft or FPS) are
received in error.
B8ZS
RIR1.1
B8ZS Code Word Detect. Set when a B8ZS code word is detected at RPOSI and
RNEGI independent of whether the B8ZS mode is selected or not via CCR2.6. Useful
for automatically setting the line coding.
FBE
RIR1.0
Frame Bit Error. Set when a Ft (D4) or FPS (ESF) framing bit is received in error.
RIR2: RECEIVE INFORMATION REGISTER 2 (Address=31 Hex)
(MSB)
(LSB)
RLOSC
LRCLC
TESF
TESE
TSLIP
RBLC
RPDV
TPDV
SYMBOL
POSITION
NAME AND DESCRIPTION
RLOSC
RIR2.7
Receive Loss of Sync Clear. Set when the framer achieves synchronization; will
remain set until read.
LRCLC
RIR2.6
Line Interface Receive Carrier Loss Clear. Set when the carrier signal is restored;
will remain set until read. See Table 7-2.
TESF
RIR2.5
Transmit Elastic Store Full. Set when the transmit elastic store buffer fills and a frame
is deleted.
TESE
RIR2.4
Transmit Elastic Store Empty. Set when the transmit elastic store buffer empties and a
frame is repeated.
TSLIP
RIR2.3
Transmit Elastic Store Slip Occurrence. Set when the transmit elastic store has either
repeated or deleted a frame.
RBLC
RIR2.2
Receive Blue Alarm Clear. Set when the Blue Alarm (AIS) is no longer detected; will
remain set until read. See Table 7-2.
RPDV
RIR2.1
Receive Pulse Density Violation. Set when the receive data stream does not meet the
ANSI T1.403 requirements for pulse density.
TPDV
RIR2.0
Transmit Pulse Density Violation. Set when the transmit data stream does not meet
the ANSI T1.403 requirements for pulse density.
RIR3: RECEIVE INFORMATION REGISTER 3 (Address=10 Hex)
(MSB)
(LSB)
RL1
RL0
JALT
LORC
FRCL
SYMBOL
POSITION
NAME AND DESCRIPTION
RL1
RIR3.7
Receive Level Bit 1. SeeTable 7-1.
RL0
RIR3.6
Receive Level Bit 0. See Table 7-1.
JALT
RIR3.5
Jitter Attenuator Limit Trip. Set when the jitter attenuator FIFO reaches to within 4
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21552L 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21552L+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21552LB 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS21552LN 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21552LN+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray