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| 型號： | DSP56321VL200R2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 58/84頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DSP 24BIT 200MHZ 196-MAPBGA |
| 標(biāo)準(zhǔn)包裝： | 750 |
| 系列： | DSP56K/Symphony |
| 類型： | 定點(diǎn) |
| 接口： | 主機(jī)接口，SSI，SCI |
| 時鐘速率： | 200MHz |
| 非易失內(nèi)存： | ROM（576 B） |
| 芯片上RAM： | 576kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.60V |
| 工作溫度： | -40°C ~ 100°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 196-FBGA |
| 供應(yīng)商設(shè)備封裝： | 196-MAPBGA（15x15） |
| 包裝： | 帶卷 (TR) |
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DSP56321 Technical Data, Rev. 11
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56321 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, TJ, in ° C can be obtained from this equation:
Equation 1:
Where:
TA
=
ambient temperature °C
RθJA
=
package junction-to-ambient thermal resistance °C/W
PD
=
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
RθJA
=
package junction-to-ambient thermal resistance °C/W
RθJC
=
package junction-to-case thermal resistance °C/W
RθCA
=
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
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| DSP56321VL220 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSP56321VL240 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSP56321VL275 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSP56321VL275 | 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor (DSP) IC |
| DSP56362 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Audio Digital Signal Processor |
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