參數(shù)資料
型號(hào): DSP56F801FA60E
廠商: Freescale Semiconductor
文件頁數(shù): 37/48頁
文件大?。?/td> 0K
描述: IC DSP 60MHZ 16KB FLASH 48-LQFP
標(biāo)準(zhǔn)包裝: 250
系列: 56F8xx
核心處理器: 56800
芯體尺寸: 16-位
速度: 60MHz
連通性: SCI,SPI
外圍設(shè)備: POR,PWM,WDT
輸入/輸出數(shù): 11
程序存儲(chǔ)器容量: 20KB(10K x 16)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 2K x 16
電壓 - 電源 (Vcc/Vdd): 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-LQFP
包裝: 托盤
56F801 Technical Data, Rev. 17
42
Freescale Semiconductor
Figure 4-2 48-pin LQFP Mechanical Information
Please see www.freescale.com for the most current case outline.
A
A1
Z
0.200 AB T-U
4X
Z
0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
P
AE
T, U, Z
DETAIL Y
BASE METAL
N
J
F
D
T-U
M
0.080
Z
AC
SECTION AE-AE
AD
G
0.080 AC
M°
TOP & BOTTOM
L °
W
K
AA
E
C
H
0.
25
0
R
9
DETAIL AD
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETER.
3.
DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
6.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE AB.
7.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION
SHALL NOT CAUSE THE D DIMENSION TO
EXCEED 0.350.
8.
MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076.
9.
EXACT SHAPE OF EACH CORNER IS
OPTIONAL.
CASE 932-03
ISSUE F
T
U
Z
AB
AC
GAU
G
E
PL
ANE
DIM
A
MIN
MAX
7.000 BSC
MILLIMETERS
A1
3.500 BSC
B
7.000 BSC
B1
3.500 BSC
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.500
0.700
M
12 REF
N
0.090
0.160
P
0.250 BSC
L
0
7
R
0.150
0.250
S
9.000 BSC
S1
4.500 BSC
V
9.000 BSC
V1
4.500 BSC
W
0.200 REF
AA
1.000 REF
°
°°
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DSP56F801FA80E 制造商:Freescale Semiconductor 功能描述:IC