參數(shù)資料
型號(hào)： DSP56F801FA80E
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： 16-bit Digital Signal Controllers
中文描述： 16位數(shù)字信號(hào)控制器
文件頁數(shù)： 44/48頁
文件大小： 375K
代理商： DSP56F801FA80E
56F801 Technical Data, Rev. 16
44
Freescale Semiconductor
Measure the thermal resistance from the junction to where the leads are attached to the case. This definition
is approximately equal to a junction to board thermal resistance.
Use the value obtained by the equation (T
J
– T
T
)/P
D
where T
T
is the temperature of the package case
determined by a thermocouple.
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
5.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation:
Provide a low-impedance path from the board power supply to each V
DD
pin on the controller, and from the
board ground to each V
SS
(GND) pin.
The minimum bypass requirement is to place 0.1
μ
F capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the ten V
DD
/V
SS
pairs, including V
DDA
/V
SSA.
Ceramic and tantalum capacitors tend to provide better
performance tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip V
DD
and V
SS
(GND)
pins are less than 0.5 inch per capacitor lead.
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields.
However, normal precautions are advised to avoid
application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an
appropriate voltage level.
相關(guān)PDF資料
PDF描述
DSP56F801 16-bit Hybrid Controller(16位混合控制器)
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DSP56F805E 16-bit Digital Signal Controllers
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DSP56F805 16-bit Hybrid Controller(16位混合控制器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSP56F801FA80E 制造商:Freescale Semiconductor 功能描述:IC
DSP56F801PB 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:16-bit Digital Signal Processor
DSP56F802 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
DSP56F802PB 制造商:未知廠家 制造商全稱:未知廠家 功能描述:56F802 16-Bit Hybrid Controller Product Brief
DSP56F802TA60 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 60Mhz/30MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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