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參數(shù)資料
型號： DSPB56364AF100
廠商： Freescale Semiconductor
文件頁數(shù)： 126/148頁
文件大?。?/td> 0K
描述： IC DSP 24BIT AUD 100MHZ 100-LQFP
標(biāo)準(zhǔn)包裝： 90
系列： DSP56K/Symphony
類型： 音頻處理器
接口： 主機接口，I²C，SAI，SPI
時鐘速率： 100MHz
非易失內(nèi)存： ROM（24 kB）
芯片上RAM： 11.25kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 3.30V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 100-LQFP
供應(yīng)商設(shè)備封裝： 100-LQFP（14x14）
包裝： 托盤
DSP56364 Technical Data, Rev. 4.1
Freescale Semiconductor
5-1
5
Design Considerations
5.1
Thermal Design Considerations
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
Where:
TA
= ambient temperature
°C
RqJA = package junction-to-ambient thermal resistance °C/W
PD
= power dissipation in package W
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance.
Where:
RθJA = package junction-to-ambient thermal resistance °C/W
RθJC = package junction-to-case thermal resistance °C/W
RθCA = package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the junction-to-case thermal
resistance in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the
junction to the outside surface of the package (case) closest to the chip mounting area when that
surface has a proper heat sink.
TJ
TA
PD RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
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