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參數資料
| 型號： | DSPB56364AF100 |
| 廠商： | Freescale Semiconductor |
| 文件頁數： | 128/148頁 |
| 文件大小： | 0K |
| 描述： | IC DSP 24BIT AUD 100MHZ 100-LQFP |
| 標準包裝： | 90 |
| 系列： | DSP56K/Symphony |
| 類型： | 音頻處理器 |
| 接口： | 主機接口，I²C，SAI，SPI |
| 時鐘速率： | 100MHz |
| 非易失內存： | ROM（24 kB） |
| 芯片上RAM： | 11.25kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 3.30V |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 100-LQFP |
| 供應商設備封裝： | 100-LQFP（14x14） |
| 包裝： | 托盤 |
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Electrical Design Considerations
DSP56364 Technical Data, Rev. 4.1
5-2
Freescale Semiconductor
To define a value approximately equal to a junction-to-board thermal resistance, the thermal
resistance is measured from the junction to where the leads are attached to the case.
If the temperature of the package case (TT) is determined by a thermocouple, the thermal resistance
is computed using the value obtained by the equation:
As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the
first definition. From a practical standpoint, that value is also suitable for determining the junction
temperature from a case thermocouple reading in forced convection environments. In natural convection,
using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple
reading on the case of the package will estimate a junction temperature slightly hotter than actual
temperature. Hence, the new thermal metric, thermal characterization parameter or
ΨJT, has been defined
to be (TJ – TT)/PD. This value gives a better estimate of the junction temperature in natural convection
when using the surface temperature of the package. Remember that surface temperature readings of
packages are subject to significant errors caused by inadequate attachment of the sensor to the surface and
to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-gauge
thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
5.2
Electrical Design Considerations
CAUTION
This device contains circuitry protecting against damage due to high static
voltage or electrical fields. However, normal precautions should be taken to
avoid exceeding maximum voltage ratings. Reliability of operation is
enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either GND or VCC). The suggested value for a pull-up or pull-down resistor
is 10 k ohm.
Use the following list of recommendations to assure correct DSP operation:
Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from
the board ground to each GND pin.
Use at least six 0.01–0.1
μF bypass capacitors positioned as close as possible to the four sides of
the package to connect the VCC power source to GND.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and
GND pins are less than 1.2 cm (0.5 inch) per capacitor lead.
Use at least a four-layer PCB with two inner layers for VCC and GND.
Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal.
This recommendation particularly applies to the address and data buses as well as the IRQA,
IRQB, IRQD, and TA pins. Maximum PCB trace lengths on the order of 15 cm (6 inches) are
recommended.
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating
capacitance. This is especially critical in systems with higher capacitive loads that could create
higher transient currents in the VCC and GND circuits.
TJ TT
–
() P
D
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| DSPB56364FU100 | 制造商:Rochester Electronics LLC 功能描述:24 BIT AUDIO DSP - Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述: |
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| DSPB56367AG150 | 功能描述:數字信號處理器和控制器 - DSP, DSC 150Mhz/150MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
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