TDLY
參數(shù)資料
型號: DSPIC30F2011-30I/SO
廠商: Microchip Technology
文件頁數(shù): 55/66頁
文件大?。?/td> 0K
描述: IC DSPIC MCU/DSP 12K 18SOIC
產(chǎn)品培訓模塊: Serial Communications using dsPIC30F I2C
Serial Communications using dsPIC30F SPI
Serial Communications using dsPIC30F UART
dsPIC30F 12 bit ADC - Part 2
dsPIC30F Addressing Modes - Part 1
dsPIC30F Architecture - Part 1
dsPIC30F DSP Engine & ALU
dsPIC30F Interrupts
dsPIC30F Motor Control PWM
dsPIC Timers
Asynchronous Stimulus
dsPIC30F Addressing Modes - Part 2
dsPIC30F Architecture - Part 2
dsPIC30F 12-bit ADC Part 1
標準包裝: 42
系列: dsPIC™ 30F
核心處理器: dsPIC
芯體尺寸: 16-位
速度: 30 MIP
連通性: I²C,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復位,POR,PWM,WDT
輸入/輸出數(shù): 12
程序存儲器容量: 12KB(4K x 24)
程序存儲器類型: 閃存
RAM 容量: 1K x 8
電壓 - 電源 (Vcc/Vdd): 2.5 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 18-SOIC(0.295",7.50mm 寬)
包裝: 管件
產(chǎn)品目錄頁面: 650 (CN2011-ZH PDF)
配用: XLT18SO-1-ND - SOCKET TRANSITION 18SOIC 300MIL
AC30F005-ND - MODULE SCKT DSPIC30F 18DIP/SOIC
DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE
其它名稱: DSPIC30F201130ISO
2010 Microchip Technology Inc.
DS70102K-page 59
dsPIC30F Flash Programming Specification
P9b
TDLY5
Delay between PGD
↓by programming
executive to PGD released by
programming executive
15
μs—
P10
TDLY6
Delay between PGD released by
programming executive to first PGC
↑ of
response
5—
μs—
P11
TDLY7
Delay between clocking out response
words
10
μs—
P12a
TPROG
Row Programming cycle time
1
4
ms
ICSP mode
P12b
TPROG
Row Programming cycle time
0.8
2.6
ms
Enhanced
ICSP mode
P13a
TERA
Bulk/Row Erase cycle time
1
4
ms
ICSP mode
P13b
TERA
Bulk/Row Erase cycle time
0.8
2.6
ms
Enhanced
ICSP mode
TABLE 13-1:
AC/DC CHARACTERISTICS (CONTINUED)
AC/DC CHARACTERISTICS
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25
° C is recommended
Param.
No.
Sym
Characteristic
Min
Max
Units
Conditions
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