參數(shù)資料
型號(hào)： EM39LV80070M
廠商： ELAN Microelctronics Corp .
英文描述： DDR-I, 13/26-Bit Registered Buffer
中文描述： 分位（512Kx16）閃存
文件頁(yè)數(shù)： 10/25頁(yè)
文件大?。?/td> 295K
代理商： EM39LV80070M
EM39LV800
8M Bits (512Kx16) Flash Memory
SPECIFICATION
This specification is subject to change without further notice. (04.09.2004 V1.0)
Page 10 of
25
Device Geometry Information
Address
Data
Data
27H
0014H
Device size=2
N
Byte (14H=20; 2
20
=1MByte)
28H
29H
0001H
0000H
Flash Device Interface description; 0001H=x16-only asynchronous
interface
2AH
2BH
0000H
0000H
Maximum number of byte in multi-byte write=2
N
(00H=not
supported)
2CH
0002H
Number of Erase Sector/Block sizes supported by device
2DH
2EH
2FH
30H
00FFH
0000H
0010H
0000H
Sector Information (y+1=Number of sectors; z x 256B=sector size)
y=255+1=256 sectors (00FFH=255)
z=16 x 256 Bytes=4Kbyte/sector (0010H=16)
31H
32H
33H
34H
000FH
0000H
0000H
0001H
Block Information (y+1=Number of blocks; z x 256B=block size)
y=15+1=16 blocks (000FH=15)
z=256 x 256 Bytes=64 Kbyte/block (0100H=256)
Table 6:
Device Geometry Information
Absolute Maximum Ratings
NOTE
Applied conditions greater than those listed under these ratings may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these conditions or conditions greater than those defined in the operational sections of this
specification, are not implied. Exposure to absolute maximum stress rating conditions may
affect device reliability.
Temperature Under Bias ............................................................ –55°C to 125°C
Storage Temperature .................................................................. –65°C to 150°C
D.C. Voltage on Any Pin to Ground Potential ............................. –0.5 V to V
DD
+0.5V
Transient Voltage (<20ns) on Any Pin to Ground Potential .......... –2.0V to V
DD
+2.0V
Voltage on A9 Pin to Ground Potential......................................... –0.5 V to 13.2V
Package Power Dissipation Capability (Ta=25
°
C)........................ 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds)............ 240
°
C
Output Short Circuit Current
*
...................................................... 50mA
*
Output shorted for no more than one second.
No more than one output shorted at a time.
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