參數(shù)資料
型號: EP1K30FC256-2N
廠商: Altera
文件頁數(shù): 23/86頁
文件大?。?/td> 0K
描述: IC ACEX 1K FPGA 30K 256-FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 90
系列: ACEX-1K®
LAB/CLB數(shù): 216
邏輯元件/單元數(shù): 1728
RAM 位總計: 24576
輸入/輸出數(shù): 171
門數(shù): 119000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FBGA(17x17)
Altera Corporation
3
ACEX 1K Programmable Logic Device Family Data Sheet
D
e
ve
lo
pm
e
n
t
13
To
o
ls
Software design support and automatic place-and-route provided by
Altera development systems for Windows-based PCs and Sun
SPARCstation, and HP 9000 Series 700/800 workstations
Flexible package options are available in 100 to 484 pins, including
the innovative FineLine BGATM packages (see Tables 2 and 3)
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
DesignWare components, Verilog HDL, VHDL, and other interfaces
to popular EDA tools from manufacturers such as Cadence,
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,
VeriBest, and Viewlogic
Notes:
(1)
ACEX 1K device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), and FineLine
BGA packages.
(2)
Devices in the same package are pin-compatible, although some devices have more I/O pins than others. When
planning device migration, use the I/O pins that are common to all devices.
(3)
This option is supported with a 256-pin FineLine BGA package. By using SameFrameTM pin migration, all FineLine
BGA packages are pin-compatible. For example, a board can be designed to support 256-pin and 484-pin FineLine
BGA packages.
Table 2. ACEX 1K Package Options & I/O Pin Count
Device
100-Pin TQFP
144-Pin TQFP
208-Pin PQFP
256-Pin
FineLine BGA
484-Pin
FineLine BGA
EP1K10
66
92
120
136
136 (3)
EP1K30
102
147
171
171 (3)
EP1K50
102
147
186
249
EP1K100
147
186
333
Table 3. ACEX 1K Package Sizes
Device
100-Pin TQFP
144-Pin TQFP
208-Pin PQFP
256-Pin
FineLine BGA
484-Pin
FineLine BGA
Pitch (mm)
0.50
1.0
Area (mm2)
256
484
936
289
529
Length
× width
(mm
× mm)
16
× 16
22
× 22
30.6
× 30.6
17
× 17
23
× 23
相關(guān)PDF資料
PDF描述
RS3-1212S/H3 CONV DC/DC 3W 9-18VIN 12VOUT
VE-B12-CV-F3 CONVERTER MOD DC/DC 15V 150W
MAX6699UE34+T IC TEMP MONITOR 5CH 16TSSOP
M24308/24-2 CONN D-SUB PLUG 15POS VERT PCB
RS3-1209S/H3 CONV DC/DC 3W 9-18VIN 09VOUT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP1K30FC256-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FC256-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FI256-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FI256-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30QC208-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - ACEX 1K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256