Notes to tables: (1) Microparameters are timing delays contributed by" />
參數(shù)資料
型號(hào)： EP1K30FC256-2N
廠商： Altera
文件頁(yè)數(shù)： 54/86頁(yè)
文件大?。?/td> 0K
描述： IC ACEX 1K FPGA 30K 256-FBGA
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 90
系列： ACEX-1K®
LAB/CLB數(shù)： 216
邏輯元件/單元數(shù)： 1728
RAM 位總計(jì)： 24576
輸入/輸出數(shù)： 171
門數(shù)： 119000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-FBGA（17x17）
58
Altera Corporation
ACEX 1K Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
Microparameters are timing delays contributed by individual architectural elements. These parameters cannot be
measured explicitly.
(2)
Operating conditions: VCCIO = 3.3 V ± 10% for commercial or industrial and extended use in ACEX 1K devices
(3)
Operating conditions: VCCIO = 2.5 V ± 5% for commercial or industrial and extended use in ACEX 1K devices.
(4)
Operating conditions: VCCIO = 2.5 V or 3.3 V.
(5)
Because the RAM in the EAB is self-timed, this parameter can be ignored when the WE signal is registered.
(6)
EAB macroparameters are internal parameters that can simplify predicting the behavior of an EAB at its boundary;
these parameters are calculated by summing selected microparameters.
(7)
These parameters are worst-case values for typical applications. Post-compilation timing simulation and timing
analysis are required to determine actual worst-case performance.
Table 26. Interconnect Timing Microparameters
Symbol
Parameter
Conditions
tDIN2IOE
Delay from dedicated input pin to IOE control input
tDIN2LE
Delay from dedicated input pin to LE or EAB control input
tDIN2DATA
Delay from dedicated input or clock to LE or EAB data
tDCLK2IOE
Delay from dedicated clock pin to IOE clock
tDCLK2LE
Delay from dedicated clock pin to LE or EAB clock
tSAMELAB
Routing delay for an LE driving another LE in the same LAB
tSAMEROW
Routing delay for a row IOE, LE, or EAB driving a row IOE, LE, or EAB in the
same row
tSAMECOLUMN
Routing delay for an LE driving an IOE in the same column
tDIFFROW
Routing delay for a column IOE, LE, or EAB driving an LE or EAB in a different
row
tTWOROWS
Routing delay for a row IOE or EAB driving an LE or EAB in a different row
tLEPERIPH
Routing delay for an LE driving a control signal of an IOE via the peripheral
control bus
tLABCARRY
Routing delay for the carry-out signal of an LE driving the carry-in signal of a
different LE in a different LAB
tLABCASC
Routing delay for the cascade-out signal of an LE driving the cascade-in
signal of a different LE in a different LAB
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP1K30FC256-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FC256-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FI256-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30FI256-2N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - ACEX 1K 216 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1K30QC208-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - ACEX 1K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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