參數(shù)資料
型號(hào): EP20K100EFC324-2N
廠商: Altera
文件頁(yè)數(shù): 42/117頁(yè)
文件大?。?/td> 0K
描述: IC APEX 20KE FPGA 100K 324-FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 84
系列: APEX-20K®
LAB/CLB數(shù): 416
邏輯元件/單元數(shù): 4160
RAM 位總計(jì): 53248
輸入/輸出數(shù): 246
門數(shù): 263000
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 324-BGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)當(dāng)前第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)
30
Altera Corporation
APEX 20K Programmable Logic Device Family Data Sheet
ESBs can implement synchronous RAM, which is easier to use than
asynchronous RAM. A circuit using asynchronous RAM must generate
the RAM write enable (WE) signal, while ensuring that its data and address
signals meet setup and hold time specifications relative to the WE signal.
In contrast, the ESB’s synchronous RAM generates its own WE signal and
is self-timed with respect to the global clock. Circuits using the ESB’s self-
timed RAM must only meet the setup and hold time specifications of the
global clock.
ESB inputs are driven by the adjacent local interconnect, which in turn can
be driven by the MegaLAB or FastTrack Interconnect. Because the ESB can
be driven by the local interconnect, an adjacent LE can drive it directly for
fast memory access. ESB outputs drive the MegaLAB and FastTrack
Interconnect. In addition, ten ESB outputs, nine of which are unique
output lines, drive the local interconnect for fast connection to adjacent
LEs or for fast feedback product-term logic.
When implementing memory, each ESB can be configured in any of the
following sizes: 128
× 16, 256 × 8, 512 × 4, 1,024 × 2, or 2,048 × 1. By
combining multiple ESBs, the Quartus II software implements larger
memory blocks automatically. For example, two 128
× 16 RAM blocks can
be combined to form a 128
× 32 RAM block, and two 512 × 4 RAM blocks
can be combined to form a 512
× 8 RAM block. Memory performance does
not degrade for memory blocks up to 2,048 words deep. Each ESB can
implement a 2,048-word-deep memory; the ESBs are used in parallel,
eliminating the need for any external control logic and its associated
delays.
To create a high-speed memory block that is more than 2,048 words deep,
ESBs drive tri-state lines. Each tri-state line connects all ESBs in a column
of MegaLAB structures, and drives the MegaLAB interconnect and row
and column FastTrack Interconnect throughout the column. Each ESB
incorporates a programmable decoder to activate the tri-state driver
appropriately. For instance, to implement 8,192-word-deep memory, four
ESBs are used. Eleven address lines drive the ESB memory, and two more
drive the tri-state decoder. Depending on which 2,048-word memory
page is selected, the appropriate ESB driver is turned on, driving the
output to the tri-state line. The Quartus II software automatically
combines ESBs with tri-state lines to form deeper memory blocks. The
internal tri-state control logic is designed to avoid internal contention and
floating lines. See Figure 18.
相關(guān)PDF資料
PDF描述
EP20K100EFC324-2 IC APEX 20KE FPGA 100K 324-FBGA
GEC44DTES CONN EDGECARD 88POS .100 EYELET
GBB105DHAT CONN EDGECARD 210PS R/A .050 SLD
AMM22DTMN-S189 CONN EDGECARD 44POS R/A .156 SLD
AMM22DTMH-S189 CONN EDGECARD 44POS R/A .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP20K100EFC324-2X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 416 Macro 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K100EFC3242XN 制造商:Altera Corporation 功能描述:FPGA APEX 20K Family 100K Gates 4160 Cells 250MHz CMOS Technology 1.8V 324-Pin FBGA
EP20K100EFC324-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 416 Macro 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K100EFC324-3ES 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FPGA
EP20K100EFC324-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 416 Macro 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256