參數(shù)資料
型號(hào)： EP2AGX65DF25C6N
廠商： Altera
文件頁數(shù)： 21/90頁
文件大?。?/td> 0K
描述： IC ARRIA II GX FPGA 65K 572FBGA
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 5
系列： Arria II GX
LAB/CLB數(shù)： 2530
邏輯元件/單元數(shù)： 60214
RAM 位總計(jì)： 5371904
輸入/輸出數(shù)： 252
電源電壓： 0.87 V ~ 0.93 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 572-FBGA
供應(yīng)商設(shè)備封裝： 572-FBGA
1–20
Chapter 1: Device Datasheet for Arria II Devices
Electrical Characteristics
December 2013
Altera Corporation
Table 1–33 lists the differential I/O standard specifications for Arria II GZ devices.
Power Consumption for the Arria II Device Family
Altera offers two ways to estimate power for a design:
■
Using the Microsoft Excel-based Early Power Estimator
■
Using the Quartus II PowerPlay Power Analyzer feature
The interactive Microsoft Excel-based Early Power Estimator is typically used prior to
designing the FPGA in order to get a magnitude estimate of the device power. The
Quartus II PowerPlay Power Analyzer provides better quality estimates based on the
specifics of the design after place-and-route is complete. The PowerPlay Power
Analyzer can apply a combination of user-entered, simulation-derived, and estimated
signal activities which, when combined with detailed circuit models, can yield very
accurate power estimates.
f For more information about power estimation tools, refer to the PowerPlay Early Power
Estimator User Guide and the PowerPlay Power Analysis chapter in volume 3 of the
Quartus II Handbook.
Table 1–33. Differential I/O Standard Specifications for Arria II GZ Devices (Note 1)
I/O
Standard
VCCIO (V)
VID (mV)
VICM(DC) (V)
VOD (V) (3)
VOCM (V) (3)
Min
Typ
Max
Min
Cond.
Max
Min
Max
Min
Typ
Max
Min
Typ
Max
2.5 V
LVDS
(HIO)
2.375
2.5
2.625
100
VCM =
1.25 V
—
0.05
1.8
0.247
—
0.6
1.125
1.25
1.375
2.5 V
LVDS
(VIO)
2.375
2.5
2.625
100
VCM =
1.25 V
—
0.05
1.8
0.247
—
0.6
1
1.25
1.5
RSDS
(HIO)
2.375
2.5
2.625
100
VCM =
1.25 V
—
0.3
1.4
0.1
0.2
0.6
0.5
1.2
1.4
RSDS
(VIO)
2.375
2.5
2.625
100
VCM =
1.25 V
—
0.3
1.4
0.1
0.2
0.6
0.5
1.2
1.5
Mini-LVDS
(HIO)
2.375
2.5
2.625
200
—
600
0.4
1.32
5
0.25
—
0.6
1
1.2
1.4
Mini-LVDS
(VIO)
2.375
2.5
2.625
200
—
600
0.4
1.32
5
0.25
—
0.6
1
1.2
1.5
LVPECL
2.375
2.5
2.625
300
—
0.6
1.8
—
2.375
2.5
2.625
100
—
Notes to Table 1–33:
(1) 1.4-V/1.5-V PCML transceiver I/O standard specifications are described in “Transceiver Performance Specifications” on page 1–21.
(2) Vertical I/O (VIO) is top and bottom I/Os; horizontal I/O (HIO) is left and right I/Os.
(3) RL range: 90 RL 110 .
(4) There are no fixed VICM, VOD, and VOCM specifications for BLVDS. These specifications depend on the system topology.
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參數(shù)描述
EP2AGX65DF25C6NES 制造商:Altera Corporation 功能描述:FPGA Arria 制造商:Altera Corporation 功能描述:FPGA Arria? II GX Family 60214 Cells 400MHz 40nm Technology 0.9V 572-Pin FC-FBGA 制造商:Altera Corporation 功能描述:IC ARRIA II GX FPGA 572FBGA
EP2AGX65DF25I3 功能描述:IC ARRIA II GX FPGA 65K 572FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Arria II GX 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55）
EP2AGX65DF25I3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 2530 LABs 252 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX65DF25I5 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 2530 LABs 252 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX65DF25I5N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 2530 LABs 252 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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