參數(shù)資料
型號(hào): EPF10K130EFC484-2X
廠商: Altera
文件頁數(shù): 55/100頁
文件大?。?/td> 0K
描述: IC FLEX 10KE FPGA 130K 484-FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 60
系列: FLEX-10KE®
LAB/CLB數(shù): 832
邏輯元件/單元數(shù): 6656
RAM 位總計(jì): 65536
輸入/輸出數(shù): 369
門數(shù): 342000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FBGA(23x23)
其它名稱: EPF10K130EFC4842X
58
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Table 26. EAB Timing Microparameters
Symbol
Parameter
Conditions
tEABDATA1
Data or address delay to EAB for combinatorial input
tEABDATA2
Data or address delay to EAB for registered input
tEABWE1
Write enable delay to EAB for combinatorial input
tEABWE2
Write enable delay to EAB for registered input
tEABRE1
Read enable delay to EAB for combinatorial input
tEABRE2
Read enable delay to EAB for registered input
tEABCLK
EAB register clock delay
tEABCO
EAB register clock-to-output delay
tEABBYPASS
Bypass register delay
tEABSU
EAB register setup time before clock
tEABH
EAB register hold time after clock
tEABCLR
EAB register asynchronous clear time to output delay
tAA
Address access delay (including the read enable to output delay)
tWP
Write pulse width
tRP
Read pulse width
tWDSU
Data setup time before falling edge of write pulse
tWDH
Data hold time after falling edge of write pulse
tWASU
Address setup time before rising edge of write pulse
tWAH
Address hold time after falling edge of write pulse
tRASU
Address setup time with respect to the falling edge of the read enable
tRAH
Address hold time with respect to the falling edge of the read enable
tWO
Write enable to data output valid delay
tDD
Data-in to data-out valid delay
tEABOUT
Data-out delay
tEABCH
Clock high time
tEABCL
Clock low time
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參數(shù)描述
EPF10K130EFC484-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC484-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256